BGA Rework Station, BGA soldering station
Feature
Ideal for reworking BGA, CPGA and all other BGA Chips.
Reworks North Bridge as well as South Bridge.
Simple & effective PCB positioning with additional magnified visual aid for precise alignment and positioning along 'X-Y Axis'.
In addition to BGA chips, this device also reworks all plastic parts, PTH sockets and connectors etc.
Independent Top and Bottom Heating Unit for better temperature controls.
Sensor controlled adjustable Top unit having Gold plated Infrared Lamp for best result in BGA Reballing.
Unique feature for handling "Aligned Chips" with the help of Theta Rotation.
Safety feature for PCB protection.
Suitable for variable size of PCB and Chips.
Specifications
Durable Base Unit consisting Pre-Heater, Control Panel and Adjustable PCB Clamps with Preset & Adjustable Temperature Controls.
Stainless Steel Top Unit with Motorised Lead Screw arrangement, Visual Aid for Magnified view of Chip and Sensor controlled. Imported German heating device (Visual Output device is Optional).
Effective & durable Translation Table for precise positioning.
Theta Rotation mechanism for Chips fitted in aligned direction to the PCB.
Max. PCB size allowed: 375 mm X 455 mm.
Max. Chip size allowed: 50 mm X 50 mm.
Input Range: 180 - 240 Volts AC/ Single Phase.
Power: 1250 Watts.
Working Temperature Range: 18° - 30° C.
Humidity: 55% (Max.).
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