Specialty Chemicals

Defoamers –

ADEKA NATE B & S Series are unique and effective defoaming agents which are produced using ADEKA’s surfactant developing technologies accumulated over many years.

Reactive Surfactants –

ADEKA REASOAP Series comprises of polymerisable surfactants. They improve water resistance and other physical properties of resin film produced. They also provide excellent emulsifying characteristic and reactivity with monomers in emulsion polymerization.

PU Thickeners –

ADEKA NOL UH Series are a group of thickener / rheology modifiers which exhibit excellent performance in controlling rheology of synthetic emulsions with better leveling characteristic.

Waterborne HALs, UVA –

ADEKA NOL UC Series comprises of waterborne HALs & UVA. They have small particle size and excellent light stability.

Cosmetics –

ADEKANOL OG is a moisturizer having anti ceptic effect.

Textile Softeners –

ADEKA MINE SF Series comprises quaternary ammonium salt type softeners which are easily biodegradable.

Low Foaming Detergents –

ADEKA NOL B, BO Series comprises surfactants low foaming, good detergency, wetting, penetration, and alkali stability.

Cleaning Agent for Developing and Stripping Tanks

Chemical agents for forcibly eliminating / washing away scum that has adhered and accumulated on inside of photo resist development tanks. PCB product yield can be increased by using these chemicals for scum removal from DFR/PSR development, stripping tanks.

Soft Etching Agents

ADEKA TEC A Series comprises of soft etchants with corrosion proofing effect on copper surface. They enable high resist adhesion, improve workplace environment by reducing vapors & odors during etching. They can be used either with spray or by dip method.

ADEKA TEC CL Series comprises of versatile soft etching agents that are resistant to chlorine ions. They may be diluted with industrial water. After soft etching it enhances adhesion of resist and flux on copper surface.

Copper Surface Roughening Agents

ADEKA TEC S, SA comprises of chemicals for roughening the copper surface of PCBs. They form uniformly rough surface of microscopic pits and peaks. Also it does not affect the color quality of copper boards.

Special Micro Etchant

These chemicals reduce process time by micro-etching copper and copper alloy surface while at the same time washing away organic and inorganic substances such as oxide film, fingerprints, and fats/oils. Improves adhesion of various types of resists including photoresist and is suitable for pretreatment for plating. Suitable for surface treatment for TCP, COF and FPC, which require thin etching thickness.

Copper Half Etchant

For use in etching that adjusts the thickness of copper on substrate surface layer in micrometers. Since it is mixed with sulfuric acid when used, this chemical allows you flexibility to change composition according to the requirements of the machine being used and the amount of etching performed. Also enables control of surface smoothness or roughness according to mixture composition.