WS-24 SOLVENT CLEANER is a blend of polar and non-polar solvents ideally suited for cold cleaning utilizing ultrosonic agitations and wave or bottom brush equipment. The non polar component effectively removes non ionic solids such as soldering oils and rosin flux residues where as the polar components dissolves ionic contaminants such as flux activators which if left on printed circuit boards can cause current leakage and corrosion under humid environmental conditions. The cleaner is completely stabilized against thermal and chemical breakdown. WS-24 boils at a temperature much higher than the customary fluorinated solvents (about 46C) and chlorinated solvents (about 72C) as a result of which the solvent evaporation rate at room temperature is substantially lower making it highly economical to use. The cleaner is non-flammable and non-combustible and therefore extremely safe to use. APPLICATION Though most types of component materials and markings are not affected by WS-24, some plastics are , such as polystyrenes and polycarbonates. It is therefore necessary to establish solvent component capability prior to use.
We offer a wide range of Solder wires and other allied products manufactured to Indian and various other International specifications. Wires are manufactured in 5 core /3 core and single core including solid wires. 5 core ensures flux melts before solder, to wet the surfaces to be joined, avoiding flux voids, to form high quality uniform soldering.
Solder Sticks / Bars Alloys in the form of Solder Sticks / Extruded Bars / Ingots are manufactured using virgin metals conforming to Indian and International specifications. Can be supplied in any Tin / Lead composition for all applications including wave soldering. Popular alloy composition is 63 / 37 (Tin / Lead), which is a Eutectic composition (Melting at 183 o C) and 60 / 40 (Tin / Lead) sticks. Silvisol Sticks Composition 62 / 36 / 2 (Tin / Lead / Silver) having Eutectic composition (melting at 179o C Solidus and Liquidus temperature) are used in Wave Soldering to prevent leaching of silver from silver plated components. Pure Tin Anodes and Tin/ Lead Anodes Manufactured using highest purity metals in pure tin and any solder alloy compositions. The most popular are 60/40 alloys. Ideal for plating of copper conductors on printed circuit Boards to extend shelf life. Use of virgin metals and control of metallic impurities to a minimum level in the manufacturing process results in the optimum performance of anodes. Excessive metallic impurities in plating anodes can cause sludge formation on anodes, necking of anodes, darkening of the deposited electroplate and inferior reflow characteristics of the deposit. Strict control of the tin content of anodes provides added reliability. Casting is normally the most economical method for fabricating Tin and Tin/Lead plating anodes. The major disadvantage is that excessive grain growth due to slow cooling and alloy segregation may result. The preferred method for anode manufacture is extrusion. BT Plating Anodes are extruded under high pressure, which assures a dense, fine grain structure with continuous uniformity. Uniform dissolution of the anode in the plating bath results, with necking reduced to a minimum. The fine grain size permits the use of higher current densities without passivating the anodes. The high purity and uniformity of BT Plating Anodes provides improved anode efficiency. This mean
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