Wave Soldering Machines

Our range of Solder Recovery Systems is customized as per the specifications of our clients. These machines are available for standard and lead free solder.

Features and specifications of our range are as follows:

• Capacity of 10lb/5kg of dross
• Can quickly convert waste dross into pure solder in minutes
• Improves the wave solder machine process
• Provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging potential to discontinue the use of messy wave oils and/or dross reduction powders
• Eliminates the use of dross reducing powders and wave oils
• Pure cleaner solder  put back in to the solder pot

Advantages:

• Saves up to 50% in solder costs
• Reduces dross off site by up to 70%
• Reduces de-drossing time by up to 85%
• Recovers 50-70% pure solder from dross
• Self-contained process reduces handling of dross
• No chemicals, additives or toxic substances used
• Improves wave solder machine effectiveness by reducing shorts
• Cleans up process

Our range of wave soldering machines from small tabletop to large floor standing models cater exactly to the  production demand in the electronics industry. We offer our range in accordance with the requirement of our clients and make sure that our machines reaches them within the shortest frame of time. We have established long lasting relationships with international customers spread across the globe so as to make sure that the range that we offer is high on quality.

Features: 

• Table top or Floor standing models.

• 7",12",14',18"pcb width models.

• Single or Dual(smd) wave option.

• Lead Free or Non Lead Free versions.

• Carrier conveyor or Finger conveyor type.

• Micro Controller based design.

• Memory storage of programmes.

• RS 232 serial interface.

• SPC online or offline data logging.

• Fault monitoring & reporting.

• Low solder indicator

• Built-in air compressor

• Calroid,IR,Hot Air Preheater

• Wave and flux interval sensors

• Status light tower

• Slide-out Foam Fluxer with drip tray

• Solder drain valve.

Technical Specifications:

We have been offering a wide range of Manual Solder Paste / Glue Dispenser/ Manual Stencil Printer. This range is appreciated for high quality features, optimum performance, low energy consumption and long service life. Our range is available in two different models  with following features and specifications:

MM500               

• Ideal for R & D, Prototyping and small setups
• Semiautomatic and manual modes
• Programmable system ensures accurate component placement
• 45- bin motorized indexed carousel ensures right component pick
• Built-in dispenser for glue or paste
• Microprocessor control unit with USB port
• PCB placement area: max 240 x 280 mm
• Feeders bulk material: automatically indexed carousel feeder with 45-90 compartments
• Manual indexed tape feeders (option)
• Automatic tape feeders (option)

MR10

Product Features

• Ideal for R & D, Prototyping and small setups
• Fully programmable Far- IR oven
• Auto profiling equipment for exact soldering with minimal test expenditure
• Special heater surface for homogeneous heat distribution
• PCB size: 200 x 300 mm
• Soldering area: 170 x 270 mm
• Soldering Cycle: automatic, typically 4 min
• 12 storable soldering profiles
• Power consumption: 1.5 kW