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Grauer & Weil India Limited.

Mumbai, Maharashtra

Year of Establishment: 1957
IndiaMART Member Since: 2008
Products [50]
Phone: +(91)-(22)-66993000

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Products



Mild Steel Tank

Mild Steel Tank

1. ) m. S tanks are provided with thermal insulation jackets wherever necessary.
2. ) lip ducts are suitably placed on tank rims for extraction of fumes.
3. ) tanks can be provided with vertical or horizontal work agitation systems.  
4. ) all electrolytic tanks, bus bars are made from cross sections of copper.
5. ) automatic tank covering systems are available as an option to minimize fume exhaust to ensure a clean work environment.


 
 

Stainless Steel Tank

Stainless Steel Tank

1. )Generally it is constructed out of 3 mm or 5 mm thick ss 304 or ss 316.
2. ) argon arc welded.
3. ) very robust.
4. ) thermal insulation provided wherever necessary.  
5. ) usually does not require internal / external lining.


 
 

Polypropylene Tank

Polypropylene Tank

1. )P. P. Tanks are constructed from high quality pp, which are duly reinforced with coated steel / pp supports.
2. ) the larger tanks are welded by extrusion welding process, ensuring better homogenous bonds and higher joint strengths.
3. ) state-of-the-art machines are used for other fabrication processes like welding, cutting, bending etc; to ensure durability and high quality standards.
4. ) normally, it does not require lining, bonding and thermal insulation.


 
 

Alkaline De-Ruster

Alkaline derusting is the removal of metallic oxides, primarily from iron alloys. Red rust is removed by immersion, whereas black oxides generally require the use of electric current. Electrolytic alkaline derusting is very effective for the removal of smuts and residues of acid pickling

 
 

Alkaline Electro Cleaner

Heavy-duty Alkaline Electro Cleaners with chelating action. It rapidly removes smut, light rust, finger prints and soil from steel. Its superior cleaning characteristics leave the steel surface bright and completely free of contamination.

 
 

Alkaline Soak Cleaner

Alkaline soak cleaner rapidly wets metal surfaces and displaces oil, greases and shop oils from ferrous and non-ferrous metals.

 
 

Aqueous Neutral Cleaner

Aqueous neutral cleaners are suitable for removing polishing compounds, heavy soils from most metals.

 
 

Brass

Brass is an alloy of copper and zinc. It is plated on mild steel aluminium and zinc based die-castings for decorative applications. It is plated on mild steel to obtain good bonding of steel to rubber. An undercoat of nickel considerably will increase the aesthetic value of brass plated components.


 
 

Bronze Plating

Bronze is used as a barrier layer over bright acid copper to replace the use of nickel. It produces fully bright bronze deposit which is suitable as an undercoat. The deposit is hard but ductile and the colour is compatible with gold which is usually used a topcoat.

 
 

Cadmium

Electrodeposits of Cadmium are used to protect steel and cast iron against corrosion as it is electronegative to iron. Besides having excellent corrosion protective properties. Cadmium plating is employed in the aircraft industries and electrical industries where it has a specific advantage over zinc. These include low contact potential in contact with aluminium, high lubricity, higher resistance to alkalis and to sea water. Cadmium is widely used on moving parts or threaded assemblies as it has natural lubricity, minimal change in dimension due to low voluminous corrosion products.


 
 

Chrome

Chrome plating in a decorative nickel-chrome system provides a tarnish resistant,pleasing bluish, brilliant, clear deposit on nickel plating. The deposit is hard and therefore resistant to abrasion and wear. Due to these properties, a very thin coating of 0.25 to 0.8 microns of chrome provides a durable and attractive finish. Thick hard chrome deposits are employed where good surface hardness, abrasion, wear resistance and anti-seize properties are desired. Hard Chromium is widely used for gauges, cutting tools, metal forming, drawing dies, machine parts such as piston rings, cylinder liners, crank shafts for marine and aeroplane engines, bearings hydraulic gears, salvage of worn and defective machinery parts, moulds and printing rollers.


 
 

Copper

Copper electrodeposition has a variety of applications in metal finishing. An undercoat for surface finishes such as nickel chromium electrodeposits on steel, aluminum, zinc bases die-castings and plating grade plastics (ABS). As a base for oxidized or coloured finishes and other metals. In the production of electronic printed circuit boards and of electro types and printing surfaces. Electroforming of precision components and moulds. Thick deposits applied to steel as a stop-off coating in case hardening processes such as carborising and nitriding.


 
 

Electroless Nickel

Electroless Nickel (EN) plating is a process of plating Nickel Phosphorous/Boron Alloy by chemical reduction on catalytic metal surface without electric current. Electroless Nickel can be coated on variety of substrates. Electroless Nickel coatings are used in a wide range of industries such as automotive, aerospace, electronic, medicals, chemical processing, oil and gas, etc. Features : Excellent deposit uniformity, Outstanding corrosion resistance, High hardness as that of hard chrome, Low porosity, Solderability, Excellent wear and abrasion resistance.


 
 

Electroless Nickel Stripper (Metstrip)

It is non-cyanide alkaline stripper. Strips high phosporous electroless nickel deposits. Strips heat treated electroless nickel for steel parts and also copper from copper alloys. It is supplied in two components - Metstrip EN 79A a liquid material and Metstrip EN -79B a powder.
Product Code: EN79

 
 

Flash/Color Gold

Suitable for both rack and barrel plating. Offers colour variations from 14Kt pink and green to 24Kt Old English. The resistance to corrosion and tarnish is very good. Used for all types of jewellery plating, hardware, electrical and sanitary fittings, gift articles etc. Produce fully bright deposits of approximately 14 to 24 karat in thickness of approximately 0.25 micron.

 
 

Gold Strikes

Specially formulated for good adhesion producing a yellow coating. Promotes adhesion of subsequently electrodeposited precious metals. Minimizes contamination of pure gold or other precious metal plating baths.

 
 

High Carat Gold

Final colour gold with high Karat from 22 Kt to 23.5 Kt. Offers maximum purity. Colour spectrum in this series is broad. Offers excellent resistance to corrosion. Suitable for all decorative and fine jewellery applications.

 
 

Low Carat Gold

Used specially to deposit high thickness where economy is important. Mildly alkaline process designed as an undercoat in a duplex system. Easy to operate process and makes it simple to maintain karat, brightness and colour. Main applications are for fine jewellery, watches, spectacle frames, etc.

 
 

Multilayer Pcb (Ginplate)

Ginplate Cu-703 is an electroless copper plating process for printed circuit boards. It can be used as a high speed bath, plating 2.0 to 3.0 microns in 30 minutes. When operated as recommended the bath produces dense, fine grained deposits. The deposit colour is bright pink which facilitates inspection of thru-holes after plating. Ginplate Cu-703 is exceptionally stable and properly maintained solutions may be operated over long periods without decomposition.
Product Code: MLB498

 
 

Multilayer Pcb (Ginplate)

Ginplate MB - 438 system produces oxide coatings on copper. Compatible with all commonly used dielectric substrates. Ginplate MB - 438 produces self limiting oxide coating thickness and improves multilayer board reliability.
Product Code: MB438

 
 

Multilayer Pcb (Ginplate)

Ginplate MLB - 495 is the first step in the ginplate etch back/desmear process, without chromic or sulfuric acid or plasma. Ginplate MLB - 495 is a unique dielectric sensitizer. It predisposes the dielectric to exhibit a clean, micro roughned, micro-porous surface at the end of etchback / desmear process.
Product Code: MLB495

 
 

Multilayer Pcb (Ginplate)

Ginplate MLB - 497 is the second step of a three step of desmear/etch back process. It is permanganate based system consisting of highly alkaline promoter with primary and secondary oxidiser. It is regenerable and thus eliminates sludge formation
Product Code: MLB497

 
 

Nickel Stripper (Metstrip)

Metstrip S-60 is a cyanide based metal stripper. It chemically dissolves the plate. It is a free flowing powdered product which dissolves readily in water. It removes Nickel, Copper, Zinc and Silver from steel, iron alloys or Magnesium
Product Code: S-60

 
 

Nickel Stripper (Metstrip)

Metstrip 165 S is a neutral compound and is added to various acids. It rapidly strips nickel from copper and copper base alloys. Not suitable for stripping nickel from zinc base, aluminium or iron alloys
Product Code: 165-S

 
 

Nickel Stripper (Metstrip)

Metstrip S-180 is a non-cyanide alkaline stripper. It removes bright, duplex, triplex nickel and copper deposits from steel by immersion. Metstrip S-180 is supplied in two parts : Metstrip S-180 A (liquid) and Metstrip S-180 (powdered material). It is not recommended for stripping nickel, composite nickel, sulfamate nickel and copper deposits from aluminum, zinc and brass substrates.
Product Code: S-180

 
 

Nickel Stripper (Metstrip)

Metstrip E 113 is a acid based powered material. When mixed along with a liquid additive EL - 113 forms a non - fuming solution. Used for quick removal of electrolytic or electroless nickel from steel and steel alloys.
Product Code: E-113

 
 

Nickel Stripper (Metstrip)

Metstrip S is alkaline in nature and strips by simple immersion. It is light, floppy powdered compound. It strips chemically plated deposits of Nickel, brass, Copper, Zinc, Cadmium and silver from steel and other iron alloys. It is oxidising in nature.
Product Code: S

 
 

Palladium Plating

Palladium plating process is widely used to deposit a thin layer of palladium. It creates a barrier layer for nickel free applications.

 
 

Pattern Plating (Cupracid Ht Additive)

Cupracid HT Additive is high-throw acid copper system specially designed for PCB thru-hole copper electroplating. It is single component user friendly system that deposits very ductile copper.

 
 

Pattern Plating (Ginplate)

Ginplate PC-455 is an acidic liquid that is diluted with water to make an operating solution that aids in the removal of photoresist binder residue from the copper surfaces of printed circuit boards. It also removes minor soils and handling oils from copper surfaces.
Product Code: PC-455

 
 

Pattern Plating (Ginplate)

Ginplate Cu 944 is specially designed acid copper system for PCB with small holes, blind vias fine line and space circuitry and high aspect ratios. It is single component system thus eliminating need for solution balancing additives. The deposits are ductile and can withstand 5 thermal shock cycles.
Product Code: Cu-944

 
 

Pattern Plating (Ginplate)

Ginplate AD-482 is an acidic liquid material which when diluted with water can be used to clean, condition and activate copper. Ginplate AD-482 is specifically designed for use on copper surfaces of printed circuit boards. It is specially effective for deoxidizing and activating copper prior to electroplating and it will not effect most plating resists normally used in thru-hole plating operations. Ginplate AD-482 also can be used effectively to loosen and remove photoresist binder residues from the copper surfaces of printed circuit boards.
Product Code: AD-482

 
 

Pickling Agents/Additives (Gictane 70)

Powdered, acidic, fluoride useful in acid pickle of metals. Due to the fact that it is a granular solid, it is much less hazardous to handle than liquid Hydrofluoric acid.

 
 

Pickling Agents/Additives (Gictane Inhibitor 11)

An economical process, which in conjunction with sulphuric or hydrochloric acid inhibits on most steels including some hi-carbon steels. Also prevents deposition of copper on steel by immersion from acid pickles.

 
 

Spray Cleaner

Powdered alkaline heavy duty-spray cleaner for cleaning steel, copper, copper alloys and cast iron. Low foaming economical spray cleaner for removal of oil, dirt and soil.

 
 

Thru Hole Plating (Ginplate Activator)

Ginplate Activator 444 is palladium based catalyst in electroless copper plating system for printed circuit boards thru-hole plating. Ginplate activator 444 has small particle size of palladium / tin colloid that gives better ability to cover hole surface topography and better adhesion of electroless copper. It has high copper tolerance (upto 5000 ppm) and long bath life.
Product Code: 444

 
 

Thru Hole Plating (Ginplate)

Mild alkaline liquid cleaner. Effective for soak cleaning of PCB to remove tarnish, soils and finger marks. Unique conditioner for 100 % activation of hole wall. Ensures uniform coverage and adsorption of palladium from the bath. Promotes a uniform, fine grained adherent deposit.
Product Code: CC50

 
 

Thru Hole Plating (Ginplate)

Ginplate AD-481 is a powdered material that is dissolved in water to make mild etch solution for copper. Ginplate AD-481 operating solutions may be used in place of Ammonium persulphate etch in the manufacture of printed circuit boards with plated thru-holes. The primary function of the Ginplate AD-481 operating solution is to provide a clean, uniformly-etched copper surface on printed circuit boards prior to surface activation and electroless plating of thru-holes.
Product Code: AD-481

 
 

Thru Hole Plating (Ginplate)

Ginplate PC-236 is powdered concentrate that is dissolved in deionized or distilled water to make-up and replenish Ginplate Activator high-chloride, low acid concentration operating solutions. It may also be mixed with deionized or distilled water and hydrochloric acid to make pre-dip for use prior to Ginplate Activator operating solutions.
Product Code: PC-236

 
 

Thru Hole Plating (Ginplate)

The Ginplate PA-493 operating solution is used in the pretreatment cycle after activation and prior to electroless copper plating. Ginplate PA-493 operating solution improves the initial deposition rate of the subsequent electroless copper solution, promoting dense, fine grained deposits.
Product Code: PA-493

 
 

Thru Hole Plating (Ginplate)

Ginplate CU-406 is highly stable, room temperature, electroless copper plating bath designed for flash-type printed circuit board processing. Ginplate Cu-406 deposits are bright pink in colour and facilitate easy inspection of thru-holes after plating. Ginplate CU-406 is a moderate speed bath that chemically deposits a bright, dense, uniform conductive coating on the walls of thru-holes.
Product Code: CU-406

 
 

Thru Hole Plating (Ginplate)

Ginplate Cu-703 is an electroless copper plating process for printed circuit boards. It can be used as a high speed bath, plating 2.0 to 3.0 microns in 30 minutes. When operated as recommended the bath produces dense, fine grained deposits. The deposit colour is bright pink which facilitates inspection of thru-holes after plating. Ginplate Cu-703 is exceptionally stable and properly maintained solutions may be operated over long periods without decomposition.
Product Code: Cu-703

 
 

Tin Lead Stripper (Growstrip)

It is a acidic stripper of tin/ tin-lead alloys from copper. It is a sludge free process and provides bright surface after stripping. Specially formulated with a foaming agent with no fuming while stripping. Copper surface is clear and microroughned after stripping to promote adhesion.
Product Code: TL-1000

 
 

Tin Lead Stripper (Growstrip)

Growstrip TL 3000 SP is an acidic stripper of tin / tin alloys from copper. Particularly designed for spray application. Provides a bright smut free surface after striping to promote adhesion. Does not allows copper to tarnish easily. Removes tin/tin lead deposits rapidly for the intermetallic layers.
Product Code: TL-3000SP

 
 

Tin Lead Stripper (Metstrip)

Metstrip T is an alkaline stripper. It rapidly strips tin, tin-zinc and other high tin alloys from steel, copper, brass and Magnesium without attack on the basis metal. It is a powdered material and works a simple immersion.
Product Code: T

 
 

Tin Lead Stripper (Metstrip)

Metstrip TL-107 is an acidic liquid material. Specially formulated for rapid single step stripping of solder and other tin lead alloys from copper printed circuit board by immersion technique. Has a slight etching effect on copper.
Product Code: TL-107

 
 

Tin Lead Stripper (Metstrip)

Metstrip TL-142 is a acidic liquid stripper for rapid striping of solder and other tin alloys form copper clad printed circuit boards. It is a H2O2 based stripper having minimum attack on base copper. It can hold more tin or lead contents without affecting the performance.
Product Code: TL-142

 
 

Tin/Lead Strippers (Growstrip)

Growstrip TL 1000 is peroxide free - fluoride free Tin / Tin-Lead stripper for PCBs to be used in batch system for medium scale units. It has low fumes and low copper attack. It has fast and uniform stripping rate. Can be used in both spray system as well by immersion.
Product Code: TL1000

 
 

Tin/Lead Strippers (Growstrip)

Growstrip TL 3000 SP is a special formulation for stripping of Tin/Tin-Lead alloys from copper particularly designed for spray application, having a minium copper etching effect. It is a sludge free process and provides a bright surface after stripping tin or tin-lead alloy. It is specially formulated with antioxidants agent which does not allow copper to tarnish and maintain the brightness for a longer time, thereby facilating easy quantity control inspection.
Product Code: TL3000SP

 
 
Other products & services we offer
Tin Lead Stripper ()

 

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