It is a water soluble organic activated flux. It is especially adaptable for foam fluxing, however, it can also be applied by dipping or brushing. It is used where inorganic fluxes are application. It is essential that the flux residues be completely and adequately removed.

It is a halogen-free, rosin-resin free, with lower solids percentage solvent system designed for similar application as Flux -707. However, it has less foaming action that Flux-707

It is a low-foaming, zinc free acidic solution to primarily clean the brass and copper surface by removing organic contaminants and oxides. It can be used in assembling operations like core-banking, tube-header(end dipping), tube-milling and other soildering process for automotive radiators and heater cores. The flux has a specific gravity of 1.22.

It is a blend of water white rosin with surfactants similar to Flux paste S-18-A. However its midily activated per MIL-14256D

It is a rosin based coating developed to preserve the solderability of printed circuit boards bu protecting clean metalic surface from atmospheric oxidiation and other contamination. It can be applied by spraying, dipping or brushing to a circuit board which has been cleaned water rinsed.

Flux-cored wire made with high purity tin and lead alloyed in various required proportions.