Interfab Electronics India Private LimitedInterfab Electronics India Private Limited

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Showroom

Showroom

View all our products / services as a slide show.


Infrastructure

Manufacturing Set Up

  • Air conditioned , dust free, humidity controlled rooms
  • Entire production facility equipped with Anti static flooring
  • Static control & material handling aids being used 
  • The State of the art machines & equipments for PCB Assembly 
  • Trained manpower
Manufacturing Set Up

Large View

Machines & Equipment

Name Make Features
Fine pitch Chip Mounter KE 760 M Juki corporation, Japan Built in Component verification, coplanarity check, Height measurement , suitable for BGA &CSP assembly
High Speed Chip Shooter KE 2050 M Juki corporation , Japan High speed board assembly with HLC & flexiCAD software
High Speed Multi function Chip mounted KE 2060 M Juki corporation, Japan Fine pitch chips assembly (0402 to 50 mm chip size )
Lead free Reflow Oven CR M 7HAO





Unistar 2000x Precision Fine Pitch Automatic Stencil Printer
Tangtek Corporation, Taiwan





ESE,KOREA
Pin & chain conveyor , multi zone PID , Built in Thermal profile , RoHS compliant


Automatic Fiducial recognition,2D inspection.cognex vision,cleaning system
Stencil Printer Integrated Ideas & Technologies Inc, USA X,Y , Theta & Snap off Z control
Wave soldering machine Elektra Aries, Sweden
Wave soldering machine ISO DWSM 300 LF EPS, India Double SMD wave, SPC data provision, Off line data log in , RoHS compliant
Selective Soldering Machine M56 Wenesco, USA Rework & repair facilitation of through hole components
IR Reflow Oven 540 .25 SEF, Germany Quick Thermal profiling to support fast prototyping
Inspection camera Menzel, Taiwan 50X, 100X magnification for Fine pitch components
Optical Inspection systems Mantis, Vision Engg, USA Stereo zoom vision
Testing ICT & FCT , Focus 2000 Kyuoritsu, Japan Tailor made program to suit end use
Manual soldering stations ERSA, Germany Temp. controlled, Leadfree
Dip soldering & Hot air rework stations HAKKO, Japan Repair & rework facilitation
Ultrasonic Cleaning Machines Supersonics, India Efficient flux & residue removal
Ultrasonic Vapour Degreaser Thorough clean, Indian Built in heater & condenser
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Conformal Coating

  • Humidity controlled area to ensure RH < 40 %
  • Degassing of moisture and air in forced hot air controlled temperature ovens at 80 C  for 24 Hrs
  • Latest equipment , tools and techniques for masking ,spray coating and storage 
  • Immediate soaking and curing of cards after encapsulation 
  • Special moulds made to mask & protect critical components during spraying 
  • Thermometer & Hygrometer to log in temp. & humidity in encapsulation area


Packaging

Packing of Finished product in antistatic bags, static control buble foam packaging

Special enclosures with lid covers devised to ensure safe delivery of the product.

Plastic crates devised with separators to compartmentalize packing to avoid finished product damage during transportation.

During rainy season containers wrapped in Plastic covers to avoid moisture entry.

Contact us

Mr. Deepak Sawant (Managing Director)
Electronics Sadan No. 1, Ground Floor, C-19, MIDC, Electronics Zone, Near GTL, Mahape
Navi Mumbai, Maharashtra - 400 710, India
Telephone:  +(91)-(22)-27689177/ 27613527

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