A modular Product, Hybrid technology can be easily applied to wide range of products from simple resistor network to large compact modules, which are equivalent to complete electronic system. A combination of both printed circuit technology & latest in semiconductors device interconnection technology, these Hybrid Circuit features:

Robust designs
Partitioning of client’s needs
Flexibility to adopt innovative ideas
Maximization of performance/ Price Ratio
Less expensive assembly of client’s product and stock in inventory
Meeting critical requirements of circuit power voltage frequency, passive devices tolerance as well as temperature coefficient

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Multi Layer PCB ( FPGA/BGA) Assembly Fine Pitch

We are engaged in manufacturing qualitative Multi Layer PCB Assembly Fine Pitch using high grade components. These are checked on various quality parameters and are also customized according to the specifications provided by the clients. We provide these in high density design and high complex cards with large package density. Our assemblies are appreciated for high performance, sturdy construction and reliability.

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PCB Repairs and Maintainance

We are instrumental in providing speedy and efficient PCB Repairs and Maintenance services. Our trained manpower is adept to provide repair and maintenance of PCB within the stipulated time period. We ensure that we do our work efficiently to prevent any inconvenience to our clients.

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Micro Controller Based Control Card

We are providing to our clients Micro Controller Based Control Card that provide standardized way of connecting computers together to create a network. It can house up to sixteen slide in modules and support different modules workable at same time & hot swappable operations. Main & redundant power supply also ensure reliability and continuity of the systems. It is also the most suitable to choose for broadband optical data network construction.

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Switching Mode Power Supplies (SMPs)

Majority of SMPs Modules developed by Interfab are based on following inputs given by the end user

1. Packaging needs ( Over all size)
2. Operating Tamprature conditions
(Industrial,commercial)
3. Input and output vaoltages and current ratings
4. Power Dissipation, Mounting and Heat
ventilation needs

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Mr. Deepak Sawant (Managing Director)
Electronics Sadan No. 1, Ground Floor, C-19, MIDC, Electronics Zone, Near GTL, Mahape
Navi Mumbai, Maharashtra - 400 710, India
Telephone: +(91)-(22)-27689177/ 27613527

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