Surface mount technology is a collection of scientific and engineering methods needed to design, Build and test products made with electronics components, which mount to the surface of the printed circuit board without holes for leads. This definition notes both the breads of topics necessarily understand SMT, as well as that the success implementation of SMT requires the use of concurrent engineering. Concurrent engineering means that a team of design manufacture test and marketing people will complying themselves with board layout, parts and parts placement issue, solder cleaning, test,rework,and packaging before any product is made Electronic manufacturing is tending towards more and more micro to picco as the components, devices and sub- system conforming to several packer formats (  BGAs, CSPs, TAB MCM, SOIC, WSI, VHSIC MLCC, MEM ) multilayer PCBs , back panels ,self testing techniques conversional methods manufacture have to change.

INTERFAB’s CAD Design Centre has advance Computer Aided Design software covering design activities namely Schematic capture, Bom List Generation, Components Creation,  Circuit Partitioning, Placement and Routing, CAM Generation The inputs given by customer flows seamlessly through out the concurrent design environment to ensure first time right prototypes. Needless to say that INTERFAB’s design team works closely to understand design needs through interaction at each stage. The quality management system (QMS) supports the documentation and procedure laid down to turn around quickly with approvals from the end user. We offer unique CAD Conversation services where by customers can convert their old conventional hardware into latest surface mount technology (SMT) based PCB layout designs with easy available SMD components, automated assembly process having advantage of computer integrated manufacturing (CIM) environment.

 
Fabrication of Industrial grade printed circuit broads has become common however challenging demand of our wide customers. We believe in accurate documentation, & planning at initial steps to save on delivery time, cost of rejection due stringent Quality Assurance (QA) norms.    
We offer wide spectrum of specification covering bare boards of types namely Single Sided, Double Sided, and Multi Layer. The material specification covers commercial, industrial, Defense (MIL) grade, variety of thickness, fine line widths and many more details to suit end application. INTERFAB’s customer need not have to worry about process evolution, Electrical and physical verifications of cards, as Our Quality Assurance meticulously follow norms as per IPC standard applied for inward, in process in final inspection

Design of high density, highly complex cards with large component package density needs to be handle separately with extraordinary electronic deign skills. INTERFAB believes in use of Appling innovations, integrated approach and total involvement to support customers in developing multilayer PCB design. The electronic design automation tools use in our CAD center support useful facture as out line below.

• Constraint Driven
• Floor planning and placement
• Design partitioning and Interactive auto editing
• Integrate high speed design analysis
• Reduces the time required to design high speed interconnects and increases the likelihood of first pass success.
• Shortens the time required to develop optimum constraints driven PCB designs flow
• Eliminates the need for physical prototype for multiple qualification of multi-Gigabit per second serial links through advanced simulation techniques
• Improve product quality cost and performance.
  

The Advantages of SMT are: 
 
·       Miniaturization Higher packing Density
 
·        Higher reliability
 
·        Better performance
 
·        Modular Approach
 
·        Economical cost
 
·        High Production volumes
 
·        International Quality Standards

The State of The Art facility is now brought to you with following Machines & Equipments: 

Electronics Design Automation(EDA) Tools: Allegro, Cadence,USA.

Fine Pitch Multi function Mounter & Chip Shooter – KE2050RM,KE760M, JUKI Corporation Japan.

Lead Free Reflow Solder Machine SMD-CR-M7HAO

Reflow IR solder machine, SEF - 540.25, Germany.

Wave soldering machine, Elektra Aries, Sweden

Lead Free Wave Soldering ISO DWSM300LF 

Selective soldering machines include: M56 , Wenesco ,USA.

 
A modular Product:
 
Hybrid technology can be applied to a wide range of product from simple resistor network to a large compact module equivalent to complete electronic system. It is a combination of both printed circuit technology &latest in semiconductors device interconnection technology.
 
Hybrid circuit enable:

• Robust designs
• Partitioning of your needs
• Flexibility to adopt innovative ideas
• Maximization of performance/ Price Ration
• Less expensive assembly of your product and stock in inventory
• Meeting critical requirement of circuit power voltages frequency, passive devices tolerance and temperature coefficient.

 Services Offered:

• Computer Aided Design& drafting (CAD)
• Quicker evaluation- Prototypes Fabrication
• Wide Variety of Surface Mount Device
• Selection of packages to meet end needs
• Functional Testing / Test Jig
• Volume Production Reflow/ Wave Solder

 
Production Facility:

• Clean rooms
• Machinery & Equipment for SMT
• Trained Manpower
• Proven Process – Quality Standards
• Test Facility
• Rework & Repair Tools.  

The in house facility consists of CAD, PCB layout design, rapid prototyping, wide component inventory, In circuit & functional testing. With these capabilities INTERFAB supports it’s customers in field of instrumentation control and industrial automation for optimization of design to make highly reliable and economic products.

Original Equipment Manufactures (OEMs) with products such as Measuring and Test Instruments, Process Control Equipment, Plant Monitoring and Control have largely been benefited due to INTERFAB guaranty to deliver reliable and environment tested products with consistent deliverance.

INTERFAB has proven track records of design and manufacture of products for application area as given below.
 
Medical Electronics:
Electro cardio graph (ECG) recorders, Analytical lab Instrument, Sonography Equipments.
 
Defence Electronics:
Dosimeters, Missile Fire Control Equipment, Security products, Nuclear Detection Systems, Proximity Switches, and RF control units.
 
Automotive Electronics:
Vehicle control unit with embedded system, Voltage Regulators, Flasher, DC to DC Converters, Solids State Relays, Electronic Ignition Module.    

In spite of integrated approach towards process automation, INTERFAB wants to verify & validate its semi-finished & finished goods before dispatch to its valuable cliental.
 
With dedicated efforts towards continual improvement the Quality Management System designed at INTERFAB has been designed in best possible manner to cover following support to guarantee functional performance to the end user.
The Quality Plan covers: Inwards Inspection, Inprocess Inspection, validation & documentation of process steps, Incircuit Testing, Final Functional Testing.
In addition to above proper feedback from our customers& in-house production team helps us to re-design the products with successful design iteration to maximize on the yield.
The products are tested at each stage with test & measuring equipments to meet the best quality needs, tailor made Test jigs are fabricated to identify the component level defects using ICT (In Circuit Testers) & finished goods are certified with functional test report as per the test procedures devised to approve the product performance. In specific cases on demand Endurance test are carried out to ensure reliability of the end product over long term use.

Consumer electronic applications involving low cost high volume product demands mix technology approach in order to match target sale cost of end products.
We have successfully design and processed such jobs using Wave soldering process to assemble & solder sub assemblies required in products namely electronics ballast, weighing scale, lighting products, CFL chocks, SMPS (switching power supplies), etc.

With vast experience in application engineering of industrial products, successful track record & background of hardware design and development INTERFAB also offers its services in embedded design. Design development & Software testing of custom built products are based on micro-control application covering market segments such as power electronics energy conservation, pollution control safety and security system, vehicle monitoring and control. These projects are taken on turn key basis to support selective customers. A detailed study is carried out before offering cost estimates & delivery schedule with a time bound approach.