Heat Sink Compound

ISOL SL 06

ISOL 6, Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device.

Product features:

• Capable of high thermal conductivity

• Bleed resistant, non-drying, non-melt and non-curing in nature.

• Heat – resistant up 200⁰ C.

Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers.

Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications.

Packing

1 kg, 10 kg, 35 kg & 200 kg.