Jupiter Design Technologies Private Limited

Capitalizing on our cutting edge technology we are able to
design and develop assembly layouts. Our assembly layouts are based on the
following technologies such as:

• SMD
  and TH technology


• BGA,
  Ceramic BGA and Micro BGA capability


• ICT
  & Functional testing


• Flying
  Probe


• BGA
  rework capability includes Re-Balling of BGA components


• Mechanical
  assembly (consoles and jigs)


• Material
  sourcing and purchasing

 

Backed by our industrious & meticulous professionals we are able to design and develop assembling for various technological applications. Some of the technology on which our assemblies are based includes:

• SMD and TH technology
• BGA, Ceramic BGA and Micro BGA capability
• ICT & Functional testing
• Flying Probe
• BGA rework capability includes Re-Balling of BGA components
• Mechanical assembly (consoles and jigs)
• Material sourcing and purchasing

Capitalizing on our cutting edge technology we are able to design
and develop superior quality communication boards. Our communication boards are
based on the following technologies:

• Blind
  and Buried via Technology


• Micro
  via Technology


• Bookbinder
  Rigid-Flex Technology


• SMT
  and BGA Technology


• Backplane
  Technology


• RF and
  Microwave Technology

 
Some of the salient features of our communication boards are
as follows:
 

• Rigid
  up to 40 layers


• Flex
  and rigid-flex up to 28 layers


• Metal
  core boards: Copper, Aluminum, Copper Invar Copper


• Boards
  with heave sinks: Copper and Aluminum (2D or 3D)

 
Specifications:
 

• MIL-PRF-55110
  Type 2- for GY


• MIL-PRF-55100
  Type-3- for GF, GI, GM, BI, RO 4003


• Mil-P50884
  Type-4 for rigid-flex (adhesive and adhesive-less)


• UL
  approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and adhesive-less
  based product.

 

We manufacture and provide superior quality high frequency
boards that are based on latest technology such as Blind and Buried via
Technology, Micro via Technology, Bookbinder Rigid-Flex Technology, SMT and
BGA Technology, Backplane Technology and RF & Microwave Technology. Backed
by our experienced personnel we are able to offer wide range of boards. Some of
the salient features of our high frequency boards are as follows:

• Rigid
  up to 40 layers


• Flex
  and rigid-flex up to 28 layers


• Metal
  core boards: Copper, Aluminum, Copper Invar Copper


• Boards
  with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110
  Type 2- for GY


• MIL-PRF-55100
  Type-3- for GF, GI, GM, BI, RO 4003


• Mil-P50884
  Type-4  for rigid-flex (adhesive and
  adhesive-less)


• UL
  approval 94-V-0- for double sided, multi-layers and rigid-flex, AP and adhesive less based product.

Our specialized experience in digital hardware design in
both commercial and aerospace applications allows us to design and develop
optimum quality power supply boards. Some of our range encompasses:

• Advanced
  IP cores for SOC design


• VHDL/Verilog-based
  FPGA design


• FPGA
  development boards


• Fault tolerant
  computer design


• Microprocessor/
  Micro-controller based designs

We are able to design, develop and maintain our range of
power supply boards which are used in Intel X86, ARM core and SPARC platforms.
Some other application areas of our range encompass of the following:

• Intel
  8051 platform


• Inter
  X86, ARM core, SPARC platforms


• GNU C,
  C Compliers, Debuggers, Assemblers, etc


• Processor
  development boards


• Testing
  and Servicing


• Re and
  Reverse Engineering


• Functional
  Text / Environmental Text / Vibration Test


• Rigid
  and Flexible PCBs


• MIL
  55110 PCBs & Mil P-50884, UL & IPC 610


• Component
  Mounting and Stuffing


• Electronic
  Systems


• Services
  with DRDO, Space Sectors, Aircraft and other R & D Labs

We offer our services in surface mount
technology which is used for constructing electronic circuits in
which the components (SMC or Surface Mounted Components) are mounted
directly onto the surface of printed circuit boards (PCBs). SMT
components are usually smaller than its through-hole counterpart
because it has either smaller leads or no leads at all. These are
also available with short pins or leads of various styles, flat
contacts, a matrix of solder balls (BGAs), or terminations on the
body of the component. The main advantages of SMT are as
follows:

• Much higher number of components
  and many more connections per component.
  


• Fewer holes need to be drilled
  through abrasive boards.
  


• Simpler automated assembly.
  


• Small errors in component
  placement are corrected automatically (the surface tension of the
  molten solder pulls the component into alignment with the solder
  pads).
  


• Components can be placed on both
  sides of the circuit board.
  


• Lower resistance and inductance at
  the connection (leading to better performance for high frequency
  parts).
  


• Better mechanical performance
  under shake and vibration conditions.
  


• SMT parts generally cost less than
  through-hole parts.
  


• Fewer unwanted RF signal effects
  in SMT parts when compared to leaded parts, yielding better
  predictability of component characteristics.