Capitalizing on our cutting edge technology we are able to design and develop superior quality communication boards. Our communication boards are based on the following technologies:

• Blind and Buried via Technology
• Micro via Technology
• Bookbinder Rigid-Flex Technology
• SMT and BGA Technology
• Backplane Technology
• RF and Microwave Technology

 
Some of the salient features of our communication boards are as follows:
 

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heave sinks: Copper and Aluminum (2D or 3D)

 
Specifications:
 

• MIL-PRF-55110 Type 2- for GY
• MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
• Mil-P50884 Type-4 for rigid-flex (adhesive and adhesive-less)
• UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and adhesive-less based product.

 

We design and develop optimum quality PCB boards that are based on latest technologies. Our PCB boards are known for the following salient features:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110 Type 2- for GY
• MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
• Mil-P50884 Type-4 ¿ for rigid-flex (adhesive and adhesive-less)
• UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesive-less based product.

Our specialized experience in digital hardware design in both commercial and aerospace applications allows us to design and develop optimum quality power supply boards. Some of our range encompasses:

• Advanced IP cores for SOC design
• VHDL/Verilog-based FPGA design
• FPGA development boards
• Fault tolerant computer design
• Microprocessor/ Micro-controller based designs

We are able to design, develop and maintain our range of power supply boards which are used in Intel X86, ARM core and SPARC platforms. Some other application areas of our range encompass of the following:

• Intel 8051 platform
• Inter X86, ARM core, SPARC platforms
• GNU C, C Compliers, Debuggers, Assemblers, etc
• Processor development boards
• Testing and Servicing
• Re and Reverse Engineering
• Functional Text / Environmental Text / Vibration Test
• Rigid and Flexible PCBs
• MIL 55110 PCBs & Mil P-50884, UL & IPC 610
• Component Mounting and Stuffing
• Electronic Systems
• Services with DRDO, Space Sectors, Aircraft and other R & D Labs

We manufacture and provide superior quality high frequency boards that are based on latest technology such as Blind and Buried via Technology, Micro via Technology, Bookbinder Rigid-Flex Technology, SMT and BGA Technology, Backplane Technology and RF & Microwave Technology. Backed by our experienced personnel we are able to offer wide range of boards. Some of the salient features of our high frequency boards are as follows:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110 Type 2- for GY
• MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
• Mil-P50884 Type-4  for rigid-flex (adhesive and adhesive-less)
• UL approval 94-V-0- for double sided, multi-layers and rigid-flex, AP and adhesive less based product.

We use latest technology in the design and development of mixed signal boards. Some of the technology we utilize in the designing comprises of the following:

• Blind and Buried via Technology
• Micro via Technology
• Bookbinder Rigid Flex Technology
• SMT and BGA Technology
• Backplane Technology
• RF and Microwave Technology

Some of the salient features of our mixed signal boards are as follows:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110 Type 2- for GY
• MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
• Mil-P50884 Type-4 ¿ for rigid-flex (adhesive and adhesive-less)
• UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesive-less based product  

Leveraging on our tools such as Orcad, Cadence & Zuken’s with design capabilities of RF/HF, D/S & Mmulti layer, rigid & flex rigid PCBs, IPC & MIL standards, EMI/EMC & signal integrity verification, RC and reverse engineering of PCBs we are able to design and develop PCB layouts for various applications across different industries. Our technologies including analog & digital high speed designs, analog switching mode, BGA, through hole & mixed layout, buried, blind & micro via, split power plane, differential pairs, shielded & matched lines, intelligent copper pouring (polygon), guard banding and control impedance are widely used in space, aircraft and defense laboratories.

Capitalizing on our cutting edge technology we are able to design and develop assembly layouts. Our assembly layouts are based on the following technologies such as:

• SMD and TH technology
• BGA, Ceramic BGA and Micro BGA capability
• ICT & Functional testing
• Flying Probe
• BGA rework capability includes Re-Balling of BGA components
• Mechanical assembly (consoles and jigs)
• Material sourcing and purchasing

 

We design and develop technologically advanced PCI cards using our tools and technology. Our PCI cards find their applications in military for telecommunications. Owing to the excellent technology our PCI cards provides exact performance as per the requirement of our clients.

Our years of industrial experience and superior technology allow us to design and development of high speed BGA technology. For the designing we use following technologies:

• Blind and Buried via Technology
• Micro via Technology
• "Bookbinder” Rigid-Flex Technology
• SMT and BGA Technology
• Backplane Technology
• RF and Microwave Technology

Some of the salient features of our high speed BGA technology are as follows:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110 Type 2- for GY
• MIL-PRF-55100 Type-3- for GF, GI, GM, BI, RO 4003
• Mil-P50884 Type-4 ¿ for rigid-flex (adhesive and adhesive-less)
• UL approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and Adhesive-less based product.

We offer our services in surface mount technology which is used for constructing electronic circuits in which the components (SMC or Surface Mounted Components) are mounted directly onto the surface of printed circuit boards (PCBs). SMT components are usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. These are also available with short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component. The main advantages of SMT are as follows:

• Much higher number of components and many more connections per component.
  
• Fewer holes need to be drilled through abrasive boards.
  
• Simpler automated assembly.
  
• Small errors in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads).
  
• Components can be placed on both sides of the circuit board.
  
• Lower resistance and inductance at the connection (leading to better performance for high frequency parts).
  
• Better mechanical performance under shake and vibration conditions.
  
• SMT parts generally cost less than through-hole parts.
  
• Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics.
  

Leveraging on our sophisticated infrastructure and designing tools like Orcad, Cadence & Zuken’s with design capabilities of rf/hf, d/s & multi layer, rigid & flex rigid pcbs, ipc & mil standards, emi/emc & signal integrity verification, rc and reverse engineering of pcbs, we are able to fabricate digital hardware design. Our latest technologies such as analog & digital high speed designs, analog switching mode, bga, through hole & mixed layout, buried, blind & micro via, split power plane, differential pairs, shielded & matched lines, intelligent copper pouring (polygon), guard banding, control impedance and many more. Our range finds their applications in space, aircraft and defense laboratories.
 
Our boards are based on the following technologies:

• Blind and buried via technology
• Micro via technology
• Bookbinder rigid-flex technology
• SMT and BGA technology
• Backplane Technology
• RF and Microwave technology

The company manufactures a wide range of board types including:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heat sinks: Copper and Aluminum (2D or 3D)

Backed by our industrious & meticulous professionals we are able to design and develop assembling for various technological applications. Some of the technology on which our assemblies are based includes:

• SMD and TH technology
• BGA, Ceramic BGA and Micro BGA capability
• ICT & Functional testing
• Flying Probe
• BGA rework capability includes Re-Balling of BGA components
• Mechanical assembly (consoles and jigs)
• Material sourcing and purchasing