Jupiter Design Technologies Private Limited

Leveraging on our sophisticated infrastructure and designing tools like Orcad, Cadence & Zuken’s with design capabilities of rf/hf, d/s & multi layer, rigid & flex rigid pcbs, ipc & mil standards, emi/emc & signal integrity verification, rc and reverse engineering of pcbs, we are able to fabricate digital hardware design. Our latest technologies such as analog & digital high speed designs, analog switching mode, bga, through hole & mixed layout, buried, blind & micro via, split power  plane, differential  pairs,  shielded & matched lines, intelligent  copper pouring (polygon), guard banding, control impedance and many more. Our range finds their applications in space, aircraft and defense laboratories.
 
Our boards are based on the following technologies:

• Blind and buried via technology
• Micro via technology
• Bookbinder rigid-flex technology
• SMT and BGA technology
• Backplane Technology
• RF and Microwave technology

The company manufactures a wide range of board types including:

• Rigid up to 40 layers
• Flex and rigid-flex up to 28 layers
• Metal core boards: Copper, Aluminum, Copper Invar Copper
• Boards with heat sinks: Copper and Aluminum (2D or 3D) 
  

Our years of industrial experience and superior technology allow
us to design and development of high speed BGA technology. For the designing we
use following technologies:

• Blind
  and Buried via Technology


• Micro
  via Technology


• "Bookbinder”
  Rigid-Flex Technology


• SMT
  and BGA Technology


• Backplane
  Technology


• RF and
  Microwave Technology

Some of the salient features of our high speed BGA
technology are as follows:

• Rigid
  up to 40 layers


• Flex
  and rigid-flex up to 28 layers


• Metal
  core boards: Copper, Aluminum, Copper Invar Copper


• Boards
  with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110
  Type 2- for GY


• MIL-PRF-55100
  Type-3- for GF, GI, GM, BI, RO 4003


• Mil-P50884
  Type-4 ¿ for rigid-flex (adhesive and adhesive-less)


• UL
  approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and
  Adhesive-less based product.

We use latest technology in the design and development of
mixed signal boards. Some of the technology we utilize in the designing
comprises of the following:

• Blind
  and Buried via Technology


• Micro
  via Technology


• Bookbinder
  Rigid Flex Technology


• SMT
  and BGA Technology


• Backplane
  Technology


• RF and
  Microwave Technology

Some of the salient features of our mixed signal boards are
as follows:

• Rigid
  up to 40 layers


• Flex
  and rigid-flex up to 28 layers


• Metal
  core boards: Copper, Aluminum, Copper Invar Copper


• Boards
  with heave sinks: Copper and Aluminum (2D or 3D)

Specifications:

• MIL-PRF-55110
  Type 2- for GY


• MIL-PRF-55100
  Type-3- for GF, GI, GM, BI, RO 4003


• Mil-P50884
  Type-4 ¿ for rigid-flex (adhesive and adhesive-less)


• UL
  approval 94-V-0- for double sided, Multi-layers and rigid-flex, AP and
  Adhesive-less based product  

We design and develop technologically
advanced PCI cards using our tools and technology. Our PCI cards find
their applications in military for telecommunications. Owing to the
excellent technology our PCI cards provides exact performance as per
the requirement of our clients.