We follow a well managed processing system in fabrication of our assortment of printed circuit boards. It includes following optional components in its production life cycle:
• Solder mask over bare copper (SMOBC)
• Tin Plating (Electroless / Electrolytic / Immersion)
• Carbon ink
• OSP
• White tin
• Solder mask: LPI & SR1000 (Green/Blue/Red)
• CNC skip scoring
• HASL (Hot Air Solder Level)
Based on the selected components in fabrication process, we offer our entire range of PCBs in following Laminate types:
• FR-2 (UL94V-0-rated)
• FR-4 (UL94V-0-rated)
• FR-406 (UL94V-0-rated)
• FR-5 (UL94V-0-rated)
• CEM-1 (UL94V-0-rated)
• CEM-3 (UL94V-0-rated)
• Nelco N4000
• Glass epoxy
• Polyamide laminates
Taken on mechanical processing capabilities, we possess competence to provide our products as per following Mechanical Process Tolerances:
• Minimum annular ring: +/-0.005”
• Board edge to edge, routed: +/-0.005”
• Tooling hole to hole: +/-0.002”
• Hole to hole: +/-0.002”
• Tooling hole to edge: +/-0.005”
• Holes to copper registration: +/-0.005”
• Copper to solder mask: +/-0.005”
• Holes to legend: +/-0.010”
• Top to bottom registration: +/-0.005”
• Image line tolerance: 90% art work
• Edge to copper: +/-0.010”
• Solder mask clearance: +/-0.005”
• Minimum hole size: +/-0.010
• Minimum inside radius: +/-0.015”
• Minimum trace width: +/-0.005”
• Hole to hole clearance: +/-0.015”
• Pad to pad clearance: +/-0.007”
