MiniATE is India's leading source/supplier of IC Sockets. The Sockets are used for Test, Burn-in and Development.

BGA, Micro BGA,DIP ,Flatpack (Military) ,HGA (Interstitial) ,LAP, LCC ,MAP , MLF/QFN  , PLCC, PQFP/TQFP, SDIP (Shrink DIP) ,SOIC ,SOJ ,SOP ,SOT ,SSOP / TSSOP,TAP  TSOP and PGA.

MiniATE is vendor of choice for the electronic development lab engineer, Burn-in QA engineer and EMS Companies specializing in manufacture of Burn-in boards for Military, Space and other high technology applications.

 

Yamaichi offers microSD and miniSD card connectors confirming to comprehensive all standard SD card specifications. This is one of the most comprehensive range of memory card connectors in the market. We provide solutions for SD, microSD, Compact Flash and MMC cards. The reliability interms of contact and number of cycles is unmatched in the industry.

We are a trusted name in supplying female headers which are simple in design and usage. Available at economical prices, these are widely demanded in the market. Our Happ E-tec, Taiwan Female Headers are offered in Straight, Right angle, “standard profile”, “ PC104” Type, Elevated type “ 104”, SMT “low profile”, Dual entry “ low profile type”, shrouded mating type, and “ side entry” types.

MiniATE Systems  presents the new product series  Y-Sol® for the complete wiring of PV systems. PV module junction boxes for silicon and thin film modules as well as connector and cables ensure reliable operation of the systems for their entire life as well as their highest possible efficiency level. All products are developed and manufactured by Yamaichi Electronics in Germany.

Junction boxes with IP65 protection class are available for both module technologies – silicon modules (monocrystalline and polycrystalline) as well as thin film modules. Junction boxes are installed on the back of the PV modules. They have to primarily conduct the direct current generated by the module to the outside via contact terminals. The junction box comprises, with silicon wafer based modules, one or more voltage-controlled bypass diodes depending on the application. There is one bypass diode at most in the junction box for thin film modules. If one module fails due to shadowing or soiling, for instance, the bypass diodes will ensure that the current is conducted around the affected cell areas.  One feature of the Yamaichi junction box, also called J-Box, is the use of SMD diodes instead of regular radial diodes. SMD diodes have a lower thermal resistance than radial diodes. The thermal resistance of radial diodes is usually about 4 K/W. The SMD diode used by Yamaichi has a thermal resistance of only 1.5 K/W.

Therefore an SMD diode will heat up considerably less compared to a conventional radial diode. Higher current resistance, less thermal load and thus also less power loss are the advantages for the user.
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The six advantages of the Y-Sol® series at a glance:

 

• Junction boxes are available for both module types: silicon modules and thin film modules.

• Substantially lower heat generation of the junction boxes through the use of SMD bypass diodes instead of regular radial diodes. This results in higher power loading capacity and lower power loss.

• The connectors that are suitable for both module types, Y-SOL3 and Y-SOL4, are completely overmoulded.

• High pull-out forces, or in the case of the Y-SOL4 an interlock that cannot be loosened without tools, prevent incorrect loosening of the connector under load.

• First available power connector for performances of up to 30 A by Yamaichi Electronics.

• Development and production both take place exclusively in Germany. This allows the development of future products together and in close cooperation with module manufacturers and users.

 

 

Yamaichi’s Connector Series are best for ATCA and MicroATCA offer undeniable advantages compared to the press fit contacts in terms of speed, flexibility and reliability. Following are some of the features of product:

• Durable performance
• Technical accuracy
• Resistant to temperature variations
• User-friendly design

Our offering of pin headers come in 1.00, 1.27,2.00. 2.54 mm Pitch sizes and we also offer Happ E-tec Quality Headers of varying types. The types include straight, right angle, “double plastic” spacer, “PC104” SMT Straight, SMT “double plastic” spacer, SMT “slanter”, “shrouded” straight, “shrouded” right angle.

Our comprehensive offerings of production sockets are used in the development or prototype phases but are also an efficient solution for applications where regular IC updates are required. These are offered in packages like SOP (Small Outline Packages), QFP/BQFP (Quad Flat Packages and Bumpered QFP) as well as Extraction Tooling and Emulation Adapters. Adding to it we are also offering PLCC (Plastic Leaded Chip Carrier) with respective Emulation Adapters, PGA (Pin Grid Arrays) as standard and staggered versions, DIP, SDIP, & LCC packages.

Yamaichi offer ZIF SMT FPC Vertical/Horizontal, Straight types; LIF SMT FFC/FPC Horizontal, Vertical and Right angle types. The pitch of these  cable connectors are 0.80, 1.00 and 1.25 mm pitch types.

MicroClip™ is specially designed for providing new or additional test points on Printed Circuit Boards (PCB). Any engineer who is trying to debug an existing system can find this as a unique tool for probing and viewing signals on a logic analyzer, oscilloscope, meter or other instrument for almost any location on the PCB with a mounted passive device. This attaches to surface mount passive components, including resistors, capacitors and inductors. Further on its simple design allows it to attach directly to both terminals of the Device Under Test (DUT) and used in hands-free operation.

Offering ET's widest range of programming/ prototyping/ emulation adapters. These adapters are suitable for all possible package types and are indispensable for the Development/ Lab Engineer. Being available at cost effective prices, these are widely demanded across the international market.

E-tec, Switzerland BGA Sockets are offered in any chip size, grid pattern and support pitch of 0.4mm, 0.8 mm, 1mm, 1.27 mm and 1.5 mm. E-tec BGA Sockets offer Industry’s smallest footprint and support Contact life of 10000 cycles minimum. These are offered in Twist Lock, ZIF lever lock, knob lock, Solder compression less type, Quick lock compression type and are also available with SMT solder ball adapters are also offered.

AP Products offer Test clips for faster and easier DIP IC Testing, quality control inspection, and field service. Over the years, our test clips have become an indispensable tool to the electronic industry.