Shri Santoshi Industries

OVERVIEW:

 
TradeTech specialises in chemical and production solutions and distributes an extensive range of fluxes, solder, solder wire and soldering machinery and chemistry over a wide range of industries. We have aligned ourselves with a number of high quality suppliers giving customers the benefit of proven research development and production of specialised soldering products. We have an extensive range of products ex stock, most also available in bulk quantities and custom packaging. 

For custom applications we can arrange large quantities to be modified to your specifications.

RANGE:

• Anti-oxidant pellets
• De-oxidising oil
• Peelable solder mask
• Purgel
• Flux
• Kapton tape
• Solder masking tape

       

APPLICATIONS:

• Balling BGA’s
• Deoxidizing solder baths and pots
• Preventitive maintenance on wave solder machines
• Purgel is used to clean the nozzles on solder dispenseing machines
• Masking PCB areas during solder process
• Spray and foam fluxer (water based and thixotropic available) 

FEATURES:

• Water based and thixotropic fluxes available for spray and foam fluxers
• Vichem solder mask peelable and easily removable
• Heat resistant tapes for easy board masking
• Anti-oxidant pellets for lead free and leaded solders
• Anti-oxidant pellets & de-oxidising oil reduces dross in wave soldering baths
• Many fluxes available in a range of dispensing options, including pens, spray cans and bulk form. 

BENEFITS:

• Colophony-free products – safer working environment
• Less contamination and drossing of solder baths – less wastage
• Better process control through tried and proven solutions for manufacturing, production and reworking
• Faster masking of isolated areas when using masking tapes
• All products available for both leaded and lead free processes
• Complete range of products for all soldering processe

Lead-free alloys wet slower, have a greater surface tension, and operate at higher temperatures compared to tin/lead.

There are older chemistries which work with lead-free alloys, but they are typically not an optimal choice.

A flux which has been specifically developed for lead-free applications, is by design capable of accommodating the demands these alloys make on the soldering process, thus providing a more optimal process window for the end user.

We manufacture innovative products to meet specific client requirements, and which has been our prime concern and business philosophy since the very beginning. Following is the comprehensive range of products offered by SONI’S ALLOY INDUSTRIEs

• Lead Free Solders: Lead Free Solder, Lead Free Flux–Cored Solder Wire, Lead Free Solder Paste, Lead Free Post Flux, etc.

 ROHS COMPLIANT LEAD FREE SOLDER WIRE AND STICKS.

 
In Order to overcome the problem of pollution from lead poisoning, we have introduced our range of lead free solders to replace the conventional lead solders which is ROHS Compliant, This new breed of solders in available in form of Fluxcore, Solder Wire, Solid Solder Wire, Solder Stick in Sizes varing from 12 mm to 0.711 mm.

 
97/3 (TIN/COPPER) - SOLID SOLDER WIRE/ FLAME SPRAY WIRE.

96.5/3.5 (TIN/SILVER) - SOLID SOLDER WIRE. (MP- 221⁰C)

99.3/0.7- (TIN/COPPER) - FLUX CORE / SOLID SOLDER WIRE. (MP - 227⁰C )

96.5/3.5/0.5 (TIN/SILVER/COPPER) – FLUX CORE/ SOLID SOLDER WIRE. (MP - 217⁰C to 218⁰C).

Lead Free Solders

SAI make Lead free Solders have compliance with all the requirements of RoHS directives. It has higher mechanical strength, higher yield, higher reliability and excellent wetting.  Wave and Dip lead free solders are available in a choice of lead-free variants, 99.3Sn/0.7Cu, 96.5Sn/3.5Ag and 96.5Sn/3.0Ag/0.5Cu. Other alloys are available upon request.  SAI Lead-free solder is suitable for use in any wave soldering process. When converting from 63Sn/37Pb or other lead-bearing alloy, the solder pot should first be filled with pure tin. The pure tin pot should be pumped in the system for several hours to ensure that all lead from 63Sn/37Pb alloy is removed. This pure Sn should then be dumped and the pot can then be changed with lead-free solder alloy.  SAI core solders are also available with Sn/Cu eutectic and Sn/Ag/Cu. Normal hand soldering procedures and iron tip temperatures (650-750°F) can be used.  Please Note :  We can also develop and manufacture any kind of Solders, Fluxes & PCB Chemicals as per the specific requirements and specifications of the Customer.

  

LEAD-FREE NO CLEAN SOLDER PASTES

SAI lead-free solder pastes are available in a variety of chemistries, alloys, powder mesh size, and packaging and offer the following features:

§                            Excellent printability and tack force

§                            Long tack time and stencil life

§                            Excellent wetting and solderability

§                            Low residues

§                            Easily cleaned residues

§                            Pass Bellcore and IPC reliability testing

In addition, specific formulas may be requested that offer the following advantages:

§                            Easily pin probe tested

§                            High heat and humidity resistance

§                            Suitable for high-speed printing

§                            Eliminate solder defects such as voiding and solder beading

SAI Lead-Free, Alloys, Tin-Silver-Copper, Comparison, Cost, Availability, Patents,

Printing, Melting Points, Wetting, Reliability.

1. INTRODUCTION

It is inevitable that lead will be eliminated from a great deal of electronics assembly.  Whether

this will be the result of legislation, marketing pressure, or de facto trade-barriers is not

important.  The only important aspect of this issue anymore is that it is real, and that it is coming

within the next few years.  Therefore, electronics manufacturers need to be cognizant of the

solder alloy choices available to them, and the fact that not all alloys, including those within the

same families, share the same characteristics.

Based on recent industry-wide developments, it appears that the choice of candidate lead-free

alloys to replace tin-lead for electronics assembly is narrowing.  Despite a confusing patent

situation and continuing questions about reliability, the tin-silver-copper family of  alloys has

earned a great deal of positive response from various industry consortia and organizations in

recent years and the majority of manufacturers plan on implementing one of these alloys.

i

  In

general, this family of alloys demonstrates relatively low melting points, good reliability

characteristics, and, depending upon the exact composition, reasonable cost.  However, as

there are several different alloy formulations within the tin-silver-copper family, background  information is necessary to determine which alloy is best suited for the broadest range of

 

applications. 

It also should be noted that these (sometimes nominal) varying alloy compositions are confusing

to the industry and create an inventory nightmare for solder manufacturers and end-users. The

result is a higher cost for the industry. Selecting a “default” lead-free alloy benefits the entire

supply chain.  This is especially true of EMS providers, who may be forced to stock multiple

alloys based upon the requirements of their customers.

2. TIN-SILVER-COPPER ALLOY COMPARISON

The alloys tested are the most promising and popular of the tin-silver-copper alloys:

Sn96.5/Ag3.0/Cu0.5, Sn95.5/Ag3.8/Cu0.7, and Sn95.5/Ag4.0/Cu0.5.  In addition the

Sn96.2/Ag2.5/Cu0.8/Sb0.5 alloy is used in some cases as a low-silver content alternative for

comparative purposes. This paper is meant to provide the baseline information for these alloys

needed to fairly compare one to another.  Objective test methodologies were used to represent 2

key-criteria in the transition to lead-free electronics assembly.  The issues that will affect the

broadest range of users of these alloys are addressed in this study.  Included in the comparison

is availability, cost, solder paste printing, melting, wetting, wave soldering, thermal fatigue and

solder joint reliability characteristics.    Of course, individual companies are encouraged to

perform further tests in order to determine the viability of these alloys for their particular parts,

processes, and applications.

3. LEAD-FREE ALLOY ELEMENT TOLERANCES

It should be noted that solder alloys have an acceptable tolerance for each component element. 

Per IPC-J-STD-006, elements that constitute up to 5% of an alloy may vary by up to  ±  0.2%,

while elements that constitute greater than 5% of an alloy may vary by up to ± 0.5%.

For example, the Sn63/Pb37 alloy may contain between 62.5% to 63.5% tin and 36.5% to

37.5% lead.  The Sn62/Pb36/Ag2 alloy may contain between 61.5% to 62.5% tin, 35.5% to

36.5% lead and 1.8% to 2.2% silver. 

 

Lead Free Solder 1.0mm

Manufacturer and supplier of production equipment for electronic industry Motorised Cut & Bend Machine, Semi Automatic Cut & Bend Machine, Semi Automatic De-taping Machine, Wire Stripping & Twisting Machine, Lead Cutting Machine, Automatic Wire & Sleeve Cutting Machines, Auto Dip Soldering Machine, Solder Bath, P.C.B. Insertion Conveyor, Chain Conveyor, Belt Conveyor and Pre Heater.

WAVE SOLDERING MACHINE

we are capable of producing an industry relevant range of PCB soldering systems.
These soldering systems are used for removing and replacing whole components, connectors & displays in PCB boards.
Suitable for medium to high density soldering processes, these systems are available as per specifications.
We are instrumental in designing and fabricating a cutting edge range of wave soldering machines.
These are efficiently designed for ascertaining low power consumption.
Provided with independent controllers for easy maintenance, these wave soldering machines are offered to our clients in standard and customized specifications.

Specifications:

(Single Wave)
General	Power Supply	220 V AC, 50 Hz , 1 Ph., 20 Amp
	Dimensions in mm (incl Conv. Size)	L-1270MM W-610MM H-660MM
	Weight (without solder)	125KG
	Construction	Table Top Model
Solder Bath	Wave Width	200 mm
	Solder Bath Cap	90 Kg
	Max Wave Height	10mm
	Warm Up Time (Aprox)	50 min
	Solder Bath Power	2.4 KW
Flux Tank	Flux Capacity	3 Itrs
	Air Consumption	3.5 cfm at 30 psi
Conveyor	Conveyor Speed	0-2.5 M/min
	Conveyor Angle	5, 6, 7 degree in steps
Pre-Heater	Pre Heater Length	800 mm
	Pre Heater Power	1.5 Kw

hese lead-free wave solder machines include a Ti fingers conveyor which is a high temperature resistant; the solder pot is mad