We exports silver solder. Although silver solder is a three-element alloy of Ag-Cu-Zn, its melting point cannot be below 677 ∩. As such, the four-element alloys of Ag-Cu-Zn-Cd and Ag-Cu-Zn-Sn were developed by adding Cd or Sn to lower the melting point and improve the fluidity, thereby making the job easier and protecting the parent metals from overheating. As such, the four-element alloys of Ag-Cu-Zn-Cd and Ag-Cu-Zn-Sn were developed by adding Cd or Sn to lower the melting point and improve the fluidity, thereby making the job easier and protecting the parent metals from overheating. Studies are ongoing to enhance these properties by mixing the metals with ceramic and to enable the soldering of heat resistant metals such as titanium.

• Safe Silver Solder:
  

Of the 10 types of silver solders accepted as the international standards, BAg-1, BAg-1A, BAg-2 and BAg-3 are widely used in various industries including electrical engineering. However, they have a 15~25% Cd content. However, they have a 15 ~ 25% Cd content.

• Strength Of Silver Solder:
  

1.As it offers a lower melting point, it does not cause overheating and can increase soldering efficiency.
2. It has high joint strength and offers excellent electrical properties and flexibility. It has high joint strength and offers excellent electrical properties and flexibility.
3. It is easy to apply to different types of metals and can penetrate deeply into the joint area. It is easy to apply to different types of metals and can penetrate deeply into the joint area.

An electrical contact point is an important component that most represents the characteristics of electrical energy. The strength of electrical energy is that its flow can be easily controlled with a small force regardless of the volume of energy. The strength of electrical energy is that its flow can be easily controlled with a small force regardless of the volume of energy. An electrical contact point electrically switches on or off the contact for control purposes. An electrical contact point electrically switches on or off the contact for control purposes.

• Requirements of Contact point:

1. Low and stable contact resistance
   
2. Easily mountable, with a definite open / close function.
   
3. Excellent electrical and heat conductivity.
4. Durable, and little deformation of contact surface. Durable, and little deformation of contact surface.
5. Non-transferable and less consuming. Non-transferable and less consuming.

• Classifications and specifications of contact point.

1. Solid Type: The single element metallic contact point is the most widely used. Solid Type: The single element metallic contact point is the most widely used.
2. Clad Type: The composite contact point reduces costs for greater economy. Clad Type: The composite contact point reduces costs for greater economy.

• Contact Point Materials And Their Uses:

1. Ag-Ni type contact point
2. Ag-Cu type contact point
3. Ag-CdO type contact point
4. Ag- SnO2 type contact point

We exports plating agents - precious metal chemicals are high quality products manufactured by highly skilled technicians in accordance with strict ISO 9001 conditions, using precious metals and refined chemicals of 99.99% or higher purity in Korea's only clean production system. PGC, PSC, AGCN and other products manufactured by Shin Young Metal are widely used for semi-glossy plating, high speed plating, and alloy plating because of their fast extraction, high conductivity and great adhesiveness.

1. AgCn, Silver Cyanide:

White powder containing 80% or more silver is used with cyanogen because it does not dissolve in water. The highly pure silver cyanide from Shin Young Metal prevents the generation of oxidized silver and can be used for plating in a wide range of temperatures and concentrations. The highly pure silver cyanide from Shin Young Metal prevents the generation of oxidized silver and can be used for plating in a wide range of temperatures and concentrations.

2. KAg(CN)2 P, S, C = Potassium Silver Cyanide:

White crystal powder contains 54% or more silver. It can be dissolved in water or alcohol for use. It can be dissolved in water or alcohol for use. It is mainly used in the fast plating of semiconductor lead frames. It is mainly used in the fast plating of semiconductor lead frames.

3. Kau(CN)2 P, G, C = Potassium Gold Cyanide:

This Shin Young Metal product does not generate free KOH, thereby offering excellent soldering and welding during plating.

4.  Ag Powder:
Ag powder is also known as ailver powder has excellent visual density and TAP density to prevent lumping and allow even mixing. It is widely used for high quality applications because of its excellent strength and conductivity.