AT & S India Private Limited

AT & S India Private Limited

Nanjangud, Mysore, Karnataka
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Technology

AT&S has a comprehensive product portfolio, efficient manufacturing operations and high quality standards. AT&S is developing specialized PCB technologies such as thick copper, IMS, HSMtec for heat management and high current applications. AT&S increased focus on research and development has also led to more than 64 patents applied. The aim is to produce smaller volumes and more complex boards in a simpler and more efficient way. Our patented technology portfolio focuses on incorporating structure recesses (cavities) into and onto PCB´s. This facilitates deeper embedding of electronic components and makes thinner PCB´s possible.

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ECP
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ECP

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Conclusion
ECP® is AT&S’s solution to the next generation miniaturization demands of high performance applications and products.

Embedding components within an electronic module offers dramatic benefits:

  • Miniaturization through stacking of electronic components
  • Performance Gains due to the close proximity of vital passive components to the active semiconductor device

Products benefitting from ECP® will be, amongst others, high efficiency power modules, integrated wireless modules, media codecs and high signal integrity applications e.g. sensors and amplifiers.

Just as MEMS (Micro Electro-Mechanical System) and IPD (Integrated Passive Device) emerged from standard semiconductor processes, ECP builds on well proven techniques to create this new class of packages.

Major ECP advantages include:

  • Significant form factor reduction through integration
  • High reliability
  • Thermal management
  • Possibility to integrate EMI shielding
  • CTE matching

 

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2.5dtechnology Platform
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2.5dtechnology Platform

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PCB's with structural recesses are just one of many AT&S product features which meet current and future customer requirements. The feature relates to defined indents (cavities) in the PCB which can be used to position electronic components such as capacitors, transistors and even logic modules “lower”, thereby giving the assembled PCB a thinner overall structure. Electrical contacting can also take place in the cavity.

The innovation can be used in multilayer PCB's and allows for different geometric embodiments of the indentations as well as layouts with several cavities – and different depths if desired – on a single circuit board.

Besides cavities, flex-to-install PCB´s with internal and external flex layers are also possible in combination with HDI technology. By using standard multilayer materials for the external flex layers and thanks to the absence of polyimides, an extremely reliable multilayer can be produced. With the narrow flex radius, applying the technology with a flexible internal core offers great potential for miniaturization.

2.5D® Technology Platform Unlike the manufacturing technology currently available on the market (no flow prepress, stamping processes), the 2.5D® technology developed by AT&S has clear benefits for customers:

  • Use of standard multilayer base materials such as prepress, RCC film
  • Cost benefits resulting from removal of several assembly steps (e.g. stamping, routing)
  • No restrictions on cavity shapes
  • Cavities of different depths possible on a single circuit board (also in combination with rigid-flex)
  • State-of-the-art design rules
  • Application for high-volume products as special processes are not required
  • Cost advantage over conventional cavity and rigid flex concepts
  • Full HDI stacked via design rule available
  • Proven reliability for flex-to-install applications
  • No limitation in base materials
  • Solder-able surfaces in cavities
  • Different technologies can be combined (e.g. rigid-flex and cavity)
  • Mass volume production capability
  • UL approval for Cavity and rigid-flex build ups
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NucleuS
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NucleuS

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  • Material and Energy Savings with increased Production Panel Utilization
  • Panel Design Flexibility, Enlargement or Standardization Potentials
  • Improved Scaling from Panel Level to Single Card Level

 

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Alivh
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Alivh

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  • Staggered and Stacked Copper Paste Printed Laser Vias on all Layers
  • Up to 12 Layers with 3 HDI buildup Layers per side (ALIVH-C®)
  • Up to 12 Layer with interconnections on all Layers (ALIVH-G®)
  • Halogen Free Base Materials (Med TG)
  • Fine Line Design Capability
  • Improved Impedance Performance because of no Copper Plating
  • Reduced Lead Time -> Parallel Processing Method
  • Environmentally friendly Technology, Reduced Consumptions of Recourses

 

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AT & S India Private Limited Nanjangud, Nanjangud,
Mysore-570001, Karnataka, India

R V Prasad
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