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Company Factsheet

Nature of Business
Manufacturer

Year of Establishment
1989

Legal Status of Firm
Private Limited Company

GST No.
07AAACE2104Q1ZQ

Manufacturer and exporter of wooden pallets, plastic pallets, thermocol boxes etc.

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Products & Services

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PCBA Prototyping Service

Ball Bearing
East India technologies provides the excellent services in PCBA prototyping in India. Prototype plays a very crucial role in the PCB assembly. And it has great importance in the development, design and certification procedure. PCBA prototyping helps you to validate your design. And in addition it let you know how feasible is your PCBA probably in this competitive world. PCBA manufacturing service is much more convenient, cost-effective for initial investments. And it provides guaranteed quality of the product. East India technologies consequently doing PCBA prototype, and also provide value-added services for it. In case PCBA design fails due to some un-expected reasons. East India technologies testing services will help you to know the loopholes in your PCBA design. After many testing and validation. Our highly skilled team takes the best sample among all which is also called as the golden sample. As a result Golden sample further process to a third party testing facility for CE, UL, FCC and certification purposes for the ROHS markings. This sample considers as the parameter for the mass production.

 

East India Technologies is the Best PCBA service provider in india and best PCBA prototyping in India  by our highly skilled electronic engineers. We facilitate our clients, by delivering them required product as per their specification.

 

East India Technologies is providing best services in PCB prototyping.
After many tests, validation and with the help of our top quality assurance model,
we provide best version of the product, and serves the client to analyze the
functional design of their desired product.

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Printed Circuit Board Assembly Service

Ball Bearing

Printed circuit board assembly, also known as PCBA, is the process of soldering or assembly of electronic components to a PCB or printed circuit board. A circuit board prior to assembly of electronic components is known as PCB. Once electronic components are soldered, the board is called Printed Circuit Assembly (PCA) or Printed Circuit Board Assembly (PCBA).

Manufacturing printed circuit boards assembly involve electronic components need to be soldered onto it before it can be used in any electronic equipment or gadget. This assembly of electronic components depends on type of circuit board, type of electronic components and purpose of the circuit board.

Following electronics parts and consumables are needed for PCB assembly –

  • Printed Circuit Board
  • Electronic components
  • Soldering materials including solder wire, solder paste, solder bar, solder preforms (depending on the type of soldering to be done)
  • Soldering flux
  • Soldering equipments including soldering station, wave soldering machine, SMT equipment, inspection and testing equipment etc.

Once all of the above equipment, electronic parts and all raw materials are arranged, it is time to start the assembly process.

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Surface Mount Technology Service

Ball Bearing

PCB assembly process for SMD electronic components. SMD components don’t have leads or with small leads. They are mounted on the surface of the circuit board. Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. After pasting, the boards then proceed to the pick-and-place machines, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.

The boards are then conveyed into the reflow soldering oven. They first enter a pre-heat zone, where the temperature of the board and all the components is gradually, uniformly raised. The boards then enter a zone where the temperature is high enough to melt the solder particles in the solder paste, bonding the component leads to the pads on the circuit board. The surface tension of the molten solder helps keep the components in place, and if the solder pad geometries are correctly designed, surface tension automatically aligns the components on their pads. Convection soldering is the most popular reflow technology using either standard air or nitrogen gas. After soldering, the boards may be washed to remove flux residues and any stray solder balls that could short out closely spaced component leads. Finally, the boards are visually inspected or by Machine through AOI ( Automatic Optical Inspection ) for missing or misaligned components and solder bridging. If needed, they are sent to a rework station where a human operator repairs any errors. They are then usually sent to the testing stations (in-circuit testing and/or functional testing) to verify that they operate correctly.

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Wave Soldering Service

Ball Bearing

Electronic components that have leads coming out and are inserted through tiny holes in the PCB for soldering are called thru-hole (Manual Insertion / Auto Insertion ) electronic components. The assembly or soldering process for these components include wave soldering .Wave Soldering – A PCB assembly process in which solder in the form of solder bar are put in a high-temperature bath. This solder remains in the bath in molten form and forms a wave at very high temperature. 260 ~270 degree Celsius. The range of temperature depends on the type of solder. Traditional tin / lead (Sn/Pb) solder has lower melting point than lead-free (Pb-Free) solder. The PCB with all the thru-hole electronic components in holes is passed over molted solder with a help of a conveyor. The whole wave soldering process includes following steps:

  • Inserting of electronic components
  • Flux application
  • Preheat
  • Cleaning
  • Testing

Once the wave soldering is done, the PCBA is cleaned and tested. If any fault or solder joint is found, it is sent for rework, which is generally done by hand. Hand Soldering – Hand soldering is done in manufacturing units with less work load or in rework / repair jobs. A good quality soldering station or soldering iron and solder wire and flux are used in the process. We serve both RohS and Non -RohS process.

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PCBA Conformal Coating Service

Ball Bearing

PCBA Conformal Coating material is a thin polymeric film which ‘conforms’ to the contours of a printed circuit board to protect the board’s components. Typically applied at 25-250 μm (micrometers) it is applied to electronic circuitry to act as protection against moisture, dust, chemicals, and temperature extremes that, if uncoated (non-protected), could result in damage or failure of the electronics to function. When electronics must withstand harsh environments and added protection is necessary, most circuit board assembly houses coat assemblies with a layer of transparent conformal coating rather than potting.

This coating can be completed with a spray aerosol with spray gun and is suitable for low and medium volume processing..The quality of the surface finish can be superior to all other methods Spray applications can be one of the most cost effective ways of applying conformal coating. One of the key attributes of atomised spraying is giving excellent tip coverage to components

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X Ray Inspection Service

Ball Bearing

X-ray inspection is a technology based on the same principles as automated optical inspection (AOI). It uses X-rays as its source, instead of visible light, to automatically inspect features, which are typically hidden from view.

An x-ray inspection produces images of the object. The image is then processed by image processing software that detects the position and size/ shape of expected features (for process optimization) or presence/ absence of unexpected/ unintended objects or features (for anomaly detection). Instead of (visible) light it uses x-rays (typically generated by an x-ray tube) that pass through the object. Opposite the x-ray emitter is a detector that either converts x-ray into visible light (creating an optical image which is then picked up by a camera) or sensor arrays that directly pick up the x-ray and convert it into an electronic image. The image is produced due to the different absorption of x-rays when passing through the object and can therefore reveal structures inside the object that are hidden from outside view.

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Box Build Product Integration Service

Ball Bearing

Final Box Assembly work initially consisted of adding small items such as brackets & panels to the printed circuit board assembly. Our capabilities and resources grew to include complex mechanical builds. Our Infra is large enough to support our electronics and mechanical assembly groups in one location. Our core Box build assembly consists of

  • Sub-Level Product Assembly
  • Product Assembly
  • System Level Assembly
  • Testing including Functional, Final, Environmental and Burn-In
  • Software Loading and Product Configuration
  • Warehousing & Order Fulfilment & Traceability
  • Packaging & Labelling including Bar Coding
  • Aftermarket Service

Our mechanical assembly team provides value-added services for customers who prefer to have EDM incorporate their completed PCB into final packaging.  Customers trust our team to deliver a final product that is built to their specifications, on time.  Our supply chain includes exceptional suppliers of metal work, plastic, and cables and our flexible scheduling allows us to ship according to your timeline.

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Automated Optical Inspection Service

Ball Bearing

Automatic optical inspection (AOI) is an automated visual inspection of the printed circuit board (PCBA) Assembly ,is the service provided by East India Technologies, where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method. It is implemented at solder paste inspection (SPI), post-reflow and pre-wave.

AOI will detect the following defects on the line 

  • Billboarding
  • Component offset
  • Component polarity
  • Component presence or absence
  • Component Skew
  • Excessive Solder Joints
  • Flipped component
  • Height Defects
  • Insufficient Paste around Leads
  • Insufficient Solder Joints
  • Lifted Leads
  • No Population tests
  • Paste Registration
  • Severely Damaged Components
  • Solder Bridges
  • Tombstoning
  • Volume Defects
  • Wrong Part
  • Bridging
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House Pallet

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    House Drum

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      Thermocol Boxes

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        Plastic Pallets

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          Wooden Pallets

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            Inspection Service

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              East India Technologies Private Limited No. 2584, Rohatagi Mansion, 2nd Floor, Hamilton Road, Kashmiri Gate, Kashmere Gate,
              Delhi-110006, ,India

              Neha Bothra ( Manager )
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