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Nag Fastening Systems

KH Cross road, Bengaluru, Karnataka

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Soldering Pastes

We are a leading Wholesale Trader of Alpha CVP 390 Lead Free Solder Paste, OM 6106 Alpha Lead Bearing Solder Paste, Alpha OM 338 M13 Lead Free Solder Paste and Alpha BGA Flux 338T Soldering Paste from Bengaluru, India.

Alpha CVP 390 Lead Free Solder Paste
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Alpha CVP 390 Lead Free Solder Paste

Rs 6,600 / KgGet Latest Price

Minimum Order Quantity: 1 Kg

Physical StateSolid
Packaging Size500 Grams
BrandAlpha
Model Name/NumberCVP 390
CompositionSACX 0307
Lot No.102080455IP

ALPHA® CVP-390 is a lead-free, Zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability. Additionally, ALPHA® CVP-390 achieves IPC7095 Class III voiding performance.


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  • Delivery Time: 1 Week

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OM 6106 Alpha Lead Bearing Solder Paste
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Physical StateSolid
BrandAlpha
Packaging Size500 gram jars, 6" and 12" cartridges, DEK ProFlow Cassettes.
Model Name/NumberOM 6106
Lot No.1011802171P
AlloyAlloys: 62Sn/36Pb/2Ag and 63Sn/37Pb
Powder SizeType 3, (25-45 mm per IPC J-STD-005)
Flux GelAvailable in 10cc and 30cc syringes for rework applications.
Tack ForceLess than 1 g/mm2 change at 25%, 50% and 75%
Viscosity89.5% metal load designated M14 for printing applications.
Coalescence TestAble to reflow at 170um circle size in Nitrogen process
Solder BallPass < 10 count (62Sn/36Pb/2Ag and 63Sn/37Pb alloy)Class 2, 1 hour Pass, 72 hour Pass

Description:
ALPHA OM-6106, is a low residue, no-clean solder paste designed to maximize SMT line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. The ALPHA OM-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability.

Details:
  • 90-4-M17
  • Mfg- 18-Jan-2021
  • Exp:- 17-July-2021

Features & Benefits:
  • ALPHA OM-6106 is suitable for ultra-fine pitch applications such as 0.5mm (20 mil) pitch Flip-Chip and 0201 assembly.
  • Excellent print repeatability to 0.25mm (10 mil) circles at high print speeds (based upon a 0.125mm (5 mil) stencil thickness).
  • Excellent response to pause performance, generating less defects due to start up.
  • Uses universally available Type 3 powder.
  • High print speed, up to 200mm/sec (8/sec) and fast release speed to give rapid print cycle times.
  • Low residue level with minimal spread for reliable underfilling processes and results.
  • Excellent solderballing characteristics.
  • Excellent reliability properties, halide-free material.

Safety:
Formulated for both standard and fine pitch SMT stencil printing with apertures 0-25mm (10 mil) diameterand print speeds up to 200mm/sec (8/sec) with standard stencil thickness of 0.100mm (4 mil) to 0.150mm (6 mil), particularly when used in conjunction with Alpha Stencils. Consult the SDS for all safety information. The most recent version of the SDS is available from AlphaAssembly.com.

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  • Delivery Time: 1 Week

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Alpha OM 338 M13 Lead Free Solder Paste
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Alpha OM 338 M13 Lead Free Solder Paste

Rs 9,000 / KgGet Latest Price

Physical StateSolid
BrandAlpha
Packaging Size500 Grams
Weight500 Grams
Model Name/NumberOM 338-M13
Lot No.101190229IP
SAC305
Composition5Sn/3ag/0.5Cu

ALPHA® OM-338-PT is a lead-free, no-clean solder paste designed for a broad range of applications.

ALPHA OM-338-PT's broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.  ALPHA OM-338-PT yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil squares) and high "through-put" applications. ALPHA OM-338-PT is formulated to offer increased in-circuit pin test yields versus OM-338 without compromising electrical reliability.



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Alpha BGA Flux 338T Soldering Paste
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Alpha BGA Flux 338T Soldering Paste

Rs 3,000 / 100 GramsGet Latest Price

Minimum Order Quantity: 1 100 Grams

Physical StateSolid
BrandAlpha
Packaging Size0.1 Kg
Model Name/NumberBGA Flux 338T
Lot No.01107851SF
Best Before02-Nov-2021
Manufacturing Date07-Nov-2020
FeaturesNo clean

This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place. After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components. 

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  • Delivery Time: 1 Week

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Nag Fastening Systems119/6 4TH Cross Lalbagh, HDFC Bank, KH Cross road, Bengaluru-560027, Karnataka, India

Dhiraj B C (Manager)

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