Osri Enterprises

Alloy Composition	Lead Free
Flux Type	Rosin
Powder Type	Type 3
Melting Point	138 C
Packaging Type	Jar
Pack Size	15g,50, 250g and 500g available
Usage/Application	For Soldering
Application	Automotive, Solar, Hand Solder, SMT Reflow, BGA Rework

QUICKFIX soldering paste is a rosin-based soldering flux used to facilitate soldering by cleaning metal surfaces and promoting strong, reliable electrical and mechanical bonds. It is available under various brand names, with Wembley and Robodo being common manufacturers.

Alloy Composition	Sn63Pb37
Flux Type	RMA
Powder Type	Type 4
Melting Point	183 C
Packaging Type	Jar
Application	Hand Solder, BGA Rework, SMT Reflow, Solar
Viscosity	High viscosity, which helps hold solder balls firmly in place during reballing
Thermal Stability	Performs effectively under working temperatures between 180°C and 250°C.
Consistency	Gel-like texture that ensures uniform distribution and minimal spattering.

KINGBO RMA-218 is a high-viscosity, no-clean solder flux paste specifically designed for professional electronics repair and assembly. It is widely used for precision tasks such as BGA reballing, SMD rework, and smartphone or laptop motherboard repairs.

Alloy Composition	Lead Free
Flux Type	RMA

RMA 229 TPF" primarily refers to the Sunshine RMA-229-TPF (UV) Flux Paste, a high-quality soldering flux used in electronics repair. While STIHL has an "RMA" series of cordless lawn mowers, there is no current model designated as the RMA 229 TPF.

Alloy Composition	Sn63Pb37
Flux Type	No Clean
Powder Type	Type 4
Melting Point	179 C
Packaging Type	Jar
Pack Size	100 g
Application	BGA Rework, SMT Reflow
Brand	Amtech

The Amtech NC-559-ASM is a professional-grade, no-clean tacky flux (often referred to as flux paste) specifically designed for high-precision electronics rework and assembly. It is a staple in the repair industry, particularly for tasks involving BGA (Ball Grid Array) reballing, SMD rework, and motherboard repairs.