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Solid State Drives

Solid State Drives

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Docking Station

Docking Station

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DDR Memory

DDR Memory

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SDRAM Memory

SDRAM Memory

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Mac Mini

Mac Mini

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Xserve Memory

Xserve Memory

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Solid State Drives
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Solid State Drives

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Solid State Drives
Precise
 
Precise

 

 

 Features:
 
- Interface: SATAII 3.0Gb/s
- Capacity: 128GB
- Compatibility: All major OS, e.g. Windows7/XP/9X /Me/NT/CE/ Vista/Windows7,
                            MAC, Linux and Unix, Solaris, Vxworks
- Housing: Complete aluminum housing
- NCQ up to 32 commands
- RAID Support
- TRIM Support
 
Performance:

- Max Read Rate: 285MB/sec
- Max Write Rate: 275MB/sec
- 4kb Random Read IOPS: 30,000
- Access Time: 0.1ms
 
Power Consumption and Environment:

Input voltage: 5V±5%
Idle: <0.75W
Active: <0.9W
Operating temperature: 0 to 70°C(Commercial) -40 to 85°C(Industrial)
Storage temperature: -40 to 85°C
Shock Endurance: 1,500G
Vibration Endurance: 20G
 
Reliability:

- MTBF: >2,000,000 hours
- Sudden power-off recovery
- Battery backup function
- High and Reliable ECC capability up to 24bits/sector
- S.M.A.R.T features optimized for SSD
- Bit error monitoring and managent
- Dynamic and static wear-leveling
- Dynamic bad block management
- SMART commands and additional SSD monitoring

 

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Docking Station
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Docking Station

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N0028USU
Docking Station


Thermaltake

Specifications

  •  
    • Mfr Part Number: N0028USU
    • Features:
      • Patented Design
      • RoHS Compliance

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DDR Memory
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DDR Memory

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DDR Memory
Micro Dimm 172-Pin



Specifications:

• 128Meg x 64

• Long Dimm 172-Pin

• Non-ECC / Non-Registered

• PC2700

• CL=3

• 333MHz

• 2.6V

This module may be manufactured by Samsung Hynix Micron Elpida Qimonda Infineon Nanya Aeneon or Memory America.This module is in stock and can ship today.

Memory spec terms
If you're not sure if a module is right for your system, use Memory America configurator for a list of guaranteed compatible modules.

NON-ECC/Non-parity — Most desktop and laptop computers take NON-ECC or Non-parity memory.

ECC/Parity — ECC or parity modules look for errors in data and are most often found in servers and other mission-critical applications used by large networks and businesses.

Unbuffered — Most PCs and workstations use unbuffered memory which is faster than registered memory.

Registered/Buffered — Registered or buffered modules delay all information transferred to the module by one clock cycle. This type of memory is primarily used in servers.

Fully buffered — Designed for next-generation servers, features an advanced memory buffer.

CL — CAS (column address strobe) latency, which is the number of clock cycles it takes before data starts to flow after a command is received. Lower CL is faster. Modules with different CL can be mixed on a system, but the system will only run at the highest (slowest) CL.

Component configuration — (For example: 64Meg x 64) Indicates the size of the memory chip components on the module.

Voltage — For example 2.6V. Indicates the power used by the module. The lower the better.

Check the glossary and FAQs for more detailed definitions.

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SDRAM Memory
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SDRAM Memory

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SDRAM Memory
Long Dimm 168-Pin
ECC Registered


• 8Meg x 72 • Long Dimm 168-Pin •ECC Registered •PC 100• 3.3V • 100MHz• 

This module may be manufactured by Samsung Hynix Micron Elpida Qimonda Infineon Nanya Aeneon or Memory America.This module is in stock and can ship today.

Memory spec terms
If you're not sure if a module is right for your system, use Memory America configurator for a list of guaranteed compatible modules.

NON-ECC/Non-parity — Most desktop and laptop computers take NON-ECC or Non-parity memory.

ECC/Parity — ECC or parity modules look for errors in data and are most often found in servers and other mission-critical applications used by large networks and businesses.

Unbuffered — Most PCs and workstations use unbuffered memory which is faster than registered memory.

Registered/Buffered — Registered or buffered modules delay all information transferred to the module by one clock cycle. This type of memory is primarily used in servers.

Fully buffered — Designed for next-generation servers, features an advanced memory buffer.

CL — CAS (column address strobe) latency, which is the number of clock cycles it takes before data starts to flow after a command is received. Lower CL is faster. Modules with different CL can be mixed on a system, but the system will only run at the highest (slowest) CL.

Component configuration — (For example: 64Meg x 64) Indicates the size of the memory chip components on the module.

Voltage — For example 2.6V. Indicates the power used by the module. The lower the better.

Check the glossary and FAQs for more detailed definitions.

 

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Imac Memory Computer System
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imac
iMac Intel Core



System Specs
Type of system:Desktops/Servers
Bus Architecture:PCI/PCI Express
Hard Drive Bus:Serial ATA
Native OS:Mac OS X version 10.4 Tiger
CPU Type:1.83GHz Intel Core Duo
Memory Specs
Standard Memory:512 MB (removable)
Maximum Memory:2.0 GB
Memory Expansion:2 sockets
Memory Comments:PC2-5300 DDR2 667MHz SDRAM SODIMMs.

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Mac Mini
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Mac Mini

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mac mini



System Specs
Type of system:Desktops/Servers
Bus Architecture:(none or n/a)
Native OS:Mac OS X 10.3
CPU Type:1.25GHz PowerPC G4
Memory Specs
Standard Memory:256 MB (removable)
Maximum Memory:1.0 GB
Memory Expansion:1 socket
Memory Comments:PC2700 DDR SDRAM DIMMs.

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Xserve Memory
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Xserve Memory

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xserve



Memory Specs
Maximum Memory:32 GB
Memory Expansion:8 sockets (4 banks of 2)  Installed in pairs of modules.
Memory Comments:Each memory slot can hold DDR2 PC2-5300 667MHz with a maximum of 4GB per slot.

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