Description: ALPHA OM-6106, is a low residue, no-clean solder paste designed to maximize SMT line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. The ALPHA OM-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability.
Features & Benefits:
ALPHA OM-6106 is suitable for ultra-fine pitch applications such as 0.5mm (20 mil) pitch Flip-Chip and 0201 assembly.
Excellent print repeatability to 0.25mm (10 mil) circles at high print speeds (based upon a 0.125mm (5 mil) stencil thickness).
Excellent response to pause performance, generating less defects due to start up.
Uses universally available Type 3 powder.
High print speed, up to 200mm/sec (8/sec) and fast release speed to give rapid print cycle times.
Low residue level with minimal spread for reliable underfilling processes and results.
Safety: Formulated for both standard and fine pitch SMT stencil printing with apertures 0-25mm (10 mil) diameterand print speeds up to 200mm/sec (8/sec) with standard stencil thickness of 0.100mm (4 mil) to 0.150mm (6 mil), particularly when used in conjunction with Alpha Stencils. Consult the SDS for all safety information. The most recent version of the SDS is available from AlphaAssembly.com.
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