• High-Quality Material – Made from durable stainless steel, ensuring long-lasting use without deformation.

• Precise 3-Pointer Design – Specially crafted for accurate alignment and reliable soldering during EMMC IC repair.

• Universal Compatibility – Suitable for reballing and repairing various smartphone and tablet EMMC chips.

• Easy to Use – Fine mesh structure allows smooth solder paste application and consistent results.

• Professional Tool – Ideal for mobile repair technicians, PCB rework, and micro-soldering tasks.

• Model-Specific Precision – Designed specifically for Samsung G991 middle layer BGA chips.
• Durable Material – Crafted from high-quality stainless steel for long-lasting, accurate performance.
• Efficient Reballing – Ensures precise solder ball placement, improving repair accuracy and reliability.
• Easy to Use – Simplifies the reballing process, saving time for technicians.
• Professional Repair Tool – Essential for mobile phone repair shops, service centers, and electronics technicians.

• Model-Specific Design – Precisely designed for the Samsung SM-G986B middle layer BGA chips.

• High-Quality Material – Made from durable stainless steel for accurate and long-lasting use.

• Accurate Reballing – Ensures precise solder ball placement for efficient and reliable rework.

• Easy to Use – Simplifies the reballing process, saving time and effort for technicians.

• Professional Repair Tool – Ideal for mobile phone repair shops, service centers, and electronics technicians.

• Model-Specific Design – Specially crafted for iPhone 14 A16 BGA chip reballing.

• High-Precision Openings – Ensures accurate solder ball alignment for stable chip rework.

• Durable Material – Made from premium stainless steel for long-lasting performance without deformation.

• Easy & Efficient Use – Simplifies the reballing process, saving time for technicians.

• Professional Repair Tool – Essential for mobile phone repair shops, service centers, and micro-soldering experts.

• Model-Specific Design – Specially made for MI17 CPU chip reballing.

• Ultra-Thin Precision – 0.12mm thickness provides accurate solder paste application and consistent results.

• High-Quality Material – Crafted from durable stainless steel, resistant to heat and deformation.

• Efficient Rework – Ensures precise solder ball alignment, improving repair reliability and speed.

• Professional Tool – Ideal for mobile phone repair technicians, service centers, and micro-soldering experts.

AMAOE Reballing Stencil Nand1 For BGA199 BGA130 BGA149 BGA67 BGA202 BGA182 BGA137 BGA63 BGA127 BGA134 BGA95 BGA107